EP3SL110F780C4N

The EP3SL110F780C4N is a Stratix® III L Field Programmable Gate Array (FPGA) from Intel, offered in a 780‑BBGA FCBGA package. It provides high logic capacity and substantial on‑chip RAM for designs that require significant programmable logic and embedded memory within a surface‑mount package.

With 107,500 logic elements, approximately 4.992 Mbits of embedded memory and 488 I/O pins, this commercial‑grade FPGA addresses applications that need dense logic integration, broad I/O connectivity, and configurable system-level control while operating from a 0.86 V to 1.15 V core supply range.

Key Features

• Core Architecture  Stratix® III L family FPGA in the EP3SL110F780C4N configuration, providing a high-density programmable logic platform.
• Logic Capacity  107,500 logic elements to support complex combinational and sequential logic implementations.
• Embedded Memory  Approximately 4.992 Mbits of on‑chip RAM for buffering, packet storage, LUT-based memory and state storage.
• High I/O Count  488 I/O pins to enable wide parallel interfaces and multiple peripheral connections.
• Power Supply  Core voltage range from 860 mV to 1.15 V to match system power budgets and typical FPGA supply domains.
• Package and Mounting  780‑BBGA (supplier device package: 780‑FBGA, 29×29) in a surface‑mount footprint for compact board integration.
• Operating Range and Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial applications.
• Regulatory Status  RoHS compliant.

Unique Advantages

• High logic density: 107,500 logic elements provide a large programmable fabric for complex designs, reducing the need for multiple discrete devices.
• Substantial embedded memory: Approximately 4.992 Mbits of on‑chip RAM supports buffering and local data storage, simplifying external memory requirements.
• Extensive I/O resources: 488 I/O pins enable broad connectivity options for parallel buses, peripherals, and multi‑interface systems.
• Compact, surface‑mount package: 780‑BBGA (29×29) package allows high‑density PCB layouts while maintaining a standardized footprint.
• Commercial temperature suitability: 0 °C to 85 °C rating matches standard commercial product environments and development platforms.
• RoHS compliant: Meets environmental compliance requirements for lead‑free assembly.

Why Choose EP3SL110F780C4N?

The EP3SL110F780C4N positions itself as a high‑density, commercially graded Stratix® III L FPGA offering a balance of programmable logic, embedded memory and extensive I/O in a compact FCBGA package. Its combination of 107,500 logic elements and approximately 4.992 Mbits of on‑chip RAM makes it suitable for designers seeking significant integration in a single device.

Delivered by Intel, this device supports designs that require scalable logic resources and broad I/O connectivity, while complying with RoHS for lead‑free assemblies. Its voltage and thermal specifications provide clear parameters for system power and thermal design during development and deployment.

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