EP3SL110F780C4L

The EP3SL110F780C4L is a Stratix® III L field programmable gate array (FPGA) IC designed for high-density digital designs. It delivers a large logic capacity alongside substantial on-chip memory and a wide I/O count to support complex, custom digital implementations.

With a core supply range of 860 mV to 1.15 V and commercial operating temperature from 0 °C to 85 °C, this surface-mount FCBGA device targets applications that require significant logic, embedded memory, and flexible I/O integration in a compact 780-ball package.

Key Features

• High Logic Capacity — 107,500 logic elements support complex combinational and sequential logic implementations.
• Logic Block Count — 4,300 logic blocks for structured resource planning and partitioning of designs.
• Embedded Memory — Approximately 4.992 Mbits of on-chip RAM to store data, buffers, and small lookup tables without external memory.
• Extensive I/O — 488 I/O pins enable wide interfacing options to peripherals, sensors, and external devices.
• Power and Core Voltage — Core supply range from 860 mV to 1.15 V to align with system power constraints and design requirements.
• Package and Mounting — 780-BBGA FCBGA package (supplier device package: 780-FBGA, 29×29) with surface-mount mounting for compact board integration.
• Commercial Temperature Range — Rated for 0 °C to 85 °C operation for standard commercial applications.
• RoHS Compliant — Manufactured in compliance with RoHS requirements.

Typical Applications

• High-density digital processing — Use the large logic element count and logic blocks to implement complex custom datapaths and control logic.
• Memory-intensive designs — Leverage approximately 4.992 Mbits of embedded RAM for buffering, packet processing, or embedded data structures without immediate reliance on external memory.
• I/O-rich interface control — Employ 488 I/Os to bridge multiple peripherals, manage parallel interfaces, or aggregate sensor and actuator signals.
• Custom accelerators — Implement application-specific hardware accelerators where high logic density and on-chip memory improve throughput and reduce external component count.

Unique Advantages

• High integration density: 107,500 logic elements reduce the need for multiple discrete devices by enabling larger functions on a single FPGA.
• Significant on-chip RAM: Approximately 4.992 Mbits of embedded memory supports localized data storage and low-latency buffering.
• Large I/O complement: 488 I/Os provide flexibility for complex board-level interfacing and multi-device connectivity.
• Compact FCBGA package: The 780-BBGA (780-FBGA, 29×29) surface-mount package allows dense placement and effective use of PCB area.
• Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with a wide range of standard electronic products and systems.
• RoHS compliance: Supports regulatory requirements for lead-free manufacturing and reduced environmental impact.

Why Choose EP3SL110F780C4L?

The EP3SL110F780C4L positions itself as a high-capacity FPGA solution for designers needing substantial logic resources, embedded memory, and a broad I/O set in a single, surface-mount FCBGA package. Its combination of 107,500 logic elements, approximately 4.992 Mbits of RAM, and 488 I/Os makes it suitable for demanding digital implementations where integration and board-area efficiency matter.

This device is a practical choice for engineering teams developing custom digital accelerators, interface controllers, or other designs that benefit from large on-chip resources and a compact 780-ball BGA footprint, while meeting commercial temperature and RoHS requirements.

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