EP3SL110F780C4

The EP3SL110F780C4 is a Stratix® III L field programmable gate array (FPGA) from Intel presented in a 780‑BBGA FCBGA package. It provides a high logic element count and substantial on‑chip RAM capacity alongside a large I/O count, making it suitable for complex, densely routed digital designs.

Key attributes visible in the device data include 107,500 logic elements, approximately 4.99 Mbits of embedded memory, 488 I/Os, a low core voltage range (0.860–1.15 V) and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic 107,500 logic elements provide the fabric capacity for high‑density combinational and sequential logic implementations.
• Embedded Memory Approximately 4.99 Mbits of on‑chip RAM for buffering, lookup tables and local storage requirements.
• I/O Density 488 user I/Os to support extensive peripheral interfacing and multi‑channel designs.
• Power Core supply range of 0.860 V to 1.15 V to match low‑voltage FPGA power domains and system constraints.
• Package and Mounting 780‑BBGA (FCBGA) package, supplier device package listed as 780‑FBGA (29×29), with surface mount mounting type for compact board integration.
• Operating Range Commercial grade operation from 0 °C to 85 °C as specified for the device.
• Regulatory Compliance RoHS compliant, meeting standard lead‑free manufacturing and disposal requirements.

Typical Applications

• High‑density digital systems — Use the large logic fabric and embedded memory to implement complex digital functions and state machines within a single device.
• Multi‑I/O interface bridging — Leverage 488 I/Os to aggregate and translate between many peripheral interfaces or parallel data channels.
• Memory‑intensive logic — Deploy the approximately 4.99 Mbits of on‑chip RAM for data buffering, FIFOs and local storage to reduce external memory dependency.

Unique Advantages

• Substantial logic capacity: 107,500 logic elements enable implementation of large logic networks and complex control logic without immediate need for multiple devices.
• Significant on‑chip RAM: Approximately 4.99 Mbits of embedded memory supports local data storage and high‑throughput buffering.
• High I/O count: 488 I/Os provide flexibility for connecting extensive peripherals, sensors, or parallel interfaces directly to the FPGA.
• Compact FCBGA package: 780‑BBGA (29×29) surface‑mount package allows dense board layouts and reliable soldered attachment.
• Low‑voltage core operation: Core supply range of 0.860–1.15 V supports lower power domains and modern system power architectures.
• Commercial temperature rating: 0 °C to 85 °C operation suited to standard commercial electronic applications.

Why Choose EP3SL110F780C4?

The EP3SL110F780C4 combines a large logic element count, substantial embedded memory and a high I/O count in a compact 780‑BBGA package, offering a balanced option for designers who need density and interfacing capability in commercial‑grade systems. Its low core voltage range and RoHS compliance further align it with contemporary PCB power designs and manufacturing practices.

As a Stratix® III L device from Intel, this FPGA is appropriate for development projects that require significant on‑chip resources and a high pin count within the specified commercial operating range. It is suited to designs where integration density, local RAM and extensive I/O are primary selection criteria.

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