EP3SE80F1152I4N

The EP3SE80F1152I4N is a Stratix® III E field programmable gate array (FPGA) supplied in a 1152-ball FCBGA package. It integrates 80,000 logic elements and approximately 6.84 Mbits of embedded memory to support complex digital designs requiring high logic density and on-chip RAM.

With 744 user I/O signals, industrial-grade qualification, and a broad operating temperature range, this device targets demanding embedded and industrial applications where compact packaging and robust environmental performance are required.

Key Features

• Logic Capacity — 80,000 logic elements to implement sizable custom digital functions and state machines on a single device.
• Embedded Memory — Approximately 6.84 Mbits of on-chip RAM for buffering, look-up tables, and local data storage without external memory.
• I/O Resources — 744 user I/O pins to support wide parallel interfaces, multiple peripherals, and high-pin-count system designs.
• Package — 1152-ball BGA (FCBGA), supplier package 1152-FBGA (35×35), surface-mount format for dense board-level integration.
• Power — Core voltage supply range from 860 mV to 1.15 V to match system power-rail constraints.
• Temperature & Grade — Industrial-grade device rated for operation from -40 °C to 100 °C for extended environmental performance.

Unique Advantages

• High logic density: 80,000 logic elements enable consolidation of multiple functions and reduce the need for additional FPGAs in the bill of materials.
• Substantial embedded memory: Approximately 6.84 Mbits of on-chip RAM lowers dependence on external memory, simplifying board layout and improving latency for on-chip buffering.
• Extensive I/O connectivity: 744 I/O pins provide design flexibility for parallel buses, sensor arrays, and multi-interface systems without external multiplexing.
• Compact, manufacturable package: 1152-BBGA (35×35) surface-mount package supports compact PCB designs and standard assembly processes.
• Industrial temperature range: Rated from -40 °C to 100 °C to support applications exposed to wide ambient conditions.
• Flexible core power: Core voltage range of 860 mV–1.15 V accommodates system power architectures and supports power optimization strategies.

Why Choose EP3SE80F1152I4N?

The EP3SE80F1152I4N combines substantial logic capacity, significant embedded memory, and a high I/O count in a compact FCBGA package, positioning it for complex, space-constrained designs that require robust environmental performance. Its industrial temperature rating and surface-mount packaging make it suitable for long-term deployment in embedded systems and industrial equipment.

This FPGA is appropriate for engineering teams and procurement looking to consolidate digital logic, reduce external memory dependencies, and maintain flexible power and I/O options in a single, manufacturable component.

Request a quote or submit a procurement inquiry to get pricing and availability for EP3SE80F1152I4N. Provide your project volume and delivery requirements to begin the sourcing process.