EP3SE80F1152I4LN

The EP3SE80F1152I4LN is a Stratix® III E Field Programmable Gate Array (FPGA) IC from Intel, offering a high logic capacity and extensive I/O in a compact FCBGA package. Designed for systems that require substantial on-chip memory and large I/O connectivity, this industrial-grade device supports designs that must operate across a wide temperature range and at low core voltages.

Key Features

• Core Logic Provides 80,000 logic elements to implement complex digital functions and custom processing pipelines.
• Embedded Memory Approximately 6.84 Mbits of total on-chip RAM for buffering, data storage, and intermediate processing without external memory.
• I/O Density Up to 744 I/O pins to support high-density connectivity for parallel interfaces, control signals, and peripheral integration.
• Power Operates from a core voltage range of 860 mV to 1.15 V to match system power-rail designs and support efficient core operation.
• Package and Mounting Supplied in a 1152-BBGA (1152-FBGA, 35×35) FCBGA package for surface-mount assembly, offering a compact footprint for high-pin-count designs.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C, supporting deployment in environments with wide temperature variations.
• Manufacturer Built by Intel, providing an established vendor source for component supply and documentation.

Typical Applications

• High-density I/O systems Leverages 744 I/O pins for designs requiring numerous parallel or serial interfaces and extensive peripheral connectivity.
• Memory‑intensive processing Uses approximately 6.84 Mbits of embedded RAM for buffering, packet processing, or intermediate data storage without immediate external memory.
• Industrial control and instrumentation Industrial temperature rating and surface-mount FCBGA packaging suit control systems and instrumentation operating across wide thermal ranges.

Unique Advantages

• High logic capacity: 80,000 logic elements enable implementation of complex state machines, custom accelerators, and extensive glue-logic in a single device.
• Substantial embedded memory: Approximately 6.84 Mbits of on-chip RAM reduces reliance on external memory, lowering BOM and board complexity.
• Extensive I/O connectivity: 744 I/Os provide design flexibility for multi-channel interfaces, sensor arrays, or high-throughput data paths.
• Industrial temperature range: Rated from −40 °C to 100 °C for robust operation in demanding environmental conditions.
• Compact high-pin-count package: 1152-BBGA (35×35) FCBGA format delivers high pin density in a mountable surface-mount package suited to space-constrained PCBs.
• Low-voltage core operation: 0.86 V–1.15 V supply range supports modern low-power system designs and power-rail compatibility.

Why Choose EP3SE80F1152I4LN?

The EP3SE80F1152I4LN positions itself as a high-capacity FPGA solution where large logic resources, significant on-chip RAM, and a very high I/O count are required within a compact FCBGA package. Its industrial temperature rating and low-voltage core operation make it suitable for robust embedded and control applications that must tolerate wide thermal swings and operate efficiently.

Backed by Intel as the manufacturer, this device is appropriate for engineering teams building scalable, memory‑rich FPGA designs that benefit from a high number of I/Os and a dense package footprint while maintaining industrial-grade environmental tolerance.

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