EP3SE80F1152I4L

The EP3SE80F1152I4L is a Stratix® III E field programmable gate array (FPGA) IC offering high logic capacity and extensive I/O in a compact ball-grid array package. It is specified for industrial-grade applications and provides a combination of large embedded memory, configurable logic resources, and a broad operating temperature range to meet demanding embedded system requirements.

Key Features

• Core Logic Approximately 80,000 logic elements and 3,200 logic array blocks provide ample programmable resources for complex digital designs.
• Embedded Memory Approximately 6.84 Mbits of on-chip RAM for buffering, packet processing, and data-path implementation.
• I/O Capacity 744 user I/Os to support high-density interfacing and multi-channel connectivity requirements.
• Power Core supply operating range from 860 mV to 1.15 V to match system power rails and regulator designs.
• Package & Mounting 1152‑BBGA FCBGA package (supplier device package: 1152‑FBGA, 35×35) in a surface-mount form factor for compact board-level integration.
• Operating Temperature Industrial temperature range from −40 °C to 100 °C for deployment in harsh or temperature-variable environments.
• Compliance RoHS compliant to support regulatory requirements for lead-free assemblies.

Typical Applications

• Industrial Control & Automation — Large logic capacity and industrial temperature rating enable control, sequencing, and real-time processing in automation equipment.
• High‑Density I/O Systems — 744 I/Os allow complex interface consolidation for communication hubs, protocol bridge designs, and mezzanine controllers.
• Memory‑Intensive Embedded Logic — Approximately 6.84 Mbits of on-chip RAM supports buffering, packet handling, and embedded data-path functions.
• Custom Hardware Accelerators — Configurable logic resources are suited to implementing tailored accelerators and offload engines for industrial platforms.

Unique Advantages

• High Logic Density: Approximately 80,000 logic elements enable implementation of large, integrated designs without immediate need for external logic devices.
• Substantial On‑Chip Memory: About 6.84 Mbits of embedded RAM reduces reliance on external memory and simplifies board-level BOM.
• Extensive I/O Count: 744 I/Os provide flexibility for multi-channel interfaces, sensors, and peripheral connectivity.
• Industrial‑Rated Operation: Specified for −40 °C to 100 °C, supporting reliable operation across a wide temperature range.
• Compact Surface‑Mount Package: 1152‑BBGA (35×35) FCBGA delivers high pin count in a space-efficient footprint for dense system designs.
• RoHS Compliant: Facilitates compliance with lead‑free manufacturing requirements.

Why Choose EP3SE80F1152I4L?

The EP3SE80F1152I4L positions itself as a high-capacity, industrial-grade FPGA solution that combines a large pool of logic elements, significant embedded memory, and a very high I/O count in a compact FCBGA package. These characteristics make it well suited for engineers designing robust embedded systems that demand integration, configurability, and reliable operation across wide temperature ranges.

Designed under the Stratix® III E family, this device offers the resource balance needed for scalability in mid-to-high complexity designs while supporting surface-mount assembly and RoHS requirements for modern manufacturing processes.

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