EP3SE80F1152I4G

IC FPGA 744 I/O 1152FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 1,490 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O744Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3200Number of Logic Elements/Cells80000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits6843392

Overview of EP3SE80F1152I4G – Field Programmable Gate Array (FPGA) IC

The EP3SE80F1152I4G is an Intel Stratix III family SRAM FPGA designed for high-performance logic, digital signal processing and embedded system integration. It delivers a balance of logic density, embedded memory and flexible I/O to address demanding communications, networking and compute-acceleration applications.

Built on selectable core-voltage and programmable power technology concepts from the Stratix III family, this device targets designs that require high throughput, on-chip memory and robust configuration/security options while operating across an industrial temperature range.

Key Features

  • Logic Capacity — Approximately 80,000 logic elements to implement complex custom logic and control functions.
  • Embedded Memory — Approximately 6.84 Mbits of on-chip RAM for buffering, FIFOs and local data storage.
  • I/O Density — 744 user I/O pins to support wide external connectivity and multiple parallel interfaces.
  • Package & Mounting — 1152‑FBGA (35×35) package in a 1152‑BBGA / FCBGA footprint; surface-mount mounting for compact system integration.
  • Power — Core voltage supply range of 0.86 V to 1.15 V with family support for selectable core voltage and programmable power optimizations.
  • Industrial Temperature Range — Rated for −40°C to 100°C operation to meet industrial environment requirements.
  • Security & Reliability — Family-level support for 256‑bit AES configuration bitstream security, CRC configuration checks, and ECC for embedded memory blocks to enhance design protection and system availability.
  • Timing & Clocking — Family features include multiple global, regional and peripheral clocks plus up to 12 PLLs for flexible clock generation and distribution.
  • High-speed I/O & Interfaces — Stratix III family I/O architecture supports high-speed differential signaling, on-chip termination and memory-interface features for external DDR/DDR2/DDR3 and other high-speed interfaces.
  • RoHS Compliant — Device meets RoHS requirements for regulatory compliance.

Typical Applications

  • High-Performance DSP & Signal Processing — Use the device’s large logic array and embedded memory for FIR filters, FFTs and other compute-intensive DSP pipelines.
  • Networking & Communications — Implement protocol engines, packet processing and high-speed serial interfaces leveraging the family’s SERDES and I/O features.
  • Memory Interface Controllers — Build controllers and buffers for external DDR/DDR2/DDR3 memory using on-die DQS support and modular I/O banks.
  • Embedded Acceleration & Custom SoC — Integrate custom accelerators or soft processors to offload compute tasks while maintaining flexible on-chip memory and connectivity.

Unique Advantages

  • Substantial Logic & Memory in One Device: Combines ~80,000 logic elements with ~6.84 Mbits of embedded RAM to reduce external component needs and simplify board design.
  • Flexible Power and Performance Trade-offs: Core voltage range and Stratix III programmable power technology enable designers to tune for either higher performance or lower power.
  • High Connectivity: 744 I/O pins and a 1152‑FBGA package allow dense external interfaces and modular I/O bank configurations for scalable I/O architectures.
  • Industrial Reliability: Rated for −40°C to 100°C operation and equipped with configuration CRC and ECC protections to support long-term system availability in demanding environments.
  • Security and IP Support: Family-level AES bitstream encryption and support for embedded processor and IP megafunctions help protect designs and accelerate development.

Why Choose EP3SE80F1152I4G?

The EP3SE80F1152I4G positions itself as a high-capacity, industrial-temperature FPGA option within the Stratix III family, combining significant logic resources, multi-megabit embedded memory and broad I/O to address compute- and memory-intensive designs. Its configurable power options and family-level reliability/security features make it suitable for systems that require sustained performance and robust operation.

This device is well suited to design teams building networking equipment, DSP accelerators, memory interface controllers or custom embedded systems that benefit from a mature FPGA architecture and an established IP ecosystem.

Request a quote or submit an inquiry to get pricing and availability for EP3SE80F1152I4G and to discuss how it can fit into your next design.

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