EP3SE80F1152I3N

The EP3SE80F1152I3N is a Stratix® III E field programmable gate array (FPGA) offered in a 1152-ball FCBGA package. It provides a high-density programmable fabric with 80,000 logic elements, substantial embedded memory and a large number of I/O pins, targeting industrial applications that require compact, reconfigurable logic and I/O integration.

Key Features

• Core Capacity — 80,000 logic elements for implementing complex digital logic and custom hardware accelerators.
• Embedded Memory — Approximately 6.84 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
• I/O Density — 744 user I/O pins to accommodate broad peripheral and interface connectivity without external multiplexing.
• Power and Voltage — Supported core supply range from 860 mV to 1.15 V to match system power-rail designs.
• Package & Mounting — 1152-FBGA (35×35) FCBGA package, surface-mount mounting suitable for compact board designs.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implement machine control logic and custom I/O aggregation using the device's 80,000 logic elements and high I/O count.
• Communications Infrastructure — Build protocol processing and packet-handling functions leveraging the FPGA’s logic capacity and on-chip memory.
• Data Acquisition and Imaging — Use the large I/O complement and embedded RAM for interfacing sensors and buffering image or measurement data.
• Test and Measurement — Develop custom signal processing and timing logic with the programmable fabric and broad I/O connectivity.

Unique Advantages

• High Logic Density: 80,000 logic elements provide headroom for complex designs and multi-function integration on a single device.
• Substantial On-Chip Memory: Approximately 6.84 Mbits of embedded RAM reduces reliance on external memory for many buffering and processing tasks.
• Extensive I/O: 744 I/O pins enable direct connection to numerous peripherals and interfaces, simplifying board-level design.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in harsh or temperature-variable industrial environments.
• Compact FCBGA Package: 1152-FBGA (35×35) package balances high density with a surface-mount form factor for space-constrained PCBs.
• Power Flexibility: Core supply range of 860 mV to 1.15 V allows integration with a variety of system power architectures.

Why Choose EP3SE80F1152I3N?

The EP3SE80F1152I3N positions itself as a high-capacity, industrial-grade FPGA for designs that need significant programmable logic, substantial embedded memory, and a large number of I/Os in a compact package. Its operating temperature range and RoHS compliance make it suitable for long-life industrial deployments.

This device is well suited for engineering teams developing industrial control systems, communications equipment, data acquisition platforms, or test instrumentation that require on-board reconfigurability, integration of multiple functions, and robust environmental performance.

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