EP3SE80F1152C4N

IC FPGA 744 I/O 1152FBGA
Part Description

Stratix® III E Field Programmable Gate Array (FPGA) IC 744 6843392 80000 1152-BBGA, FCBGA

Quantity 143 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O744Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3200Number of Logic Elements/Cells80000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6843392

Overview of EP3SE80F1152C4N – Stratix® III E Field Programmable Gate Array (FPGA) IC, 80,000 logic elements, 1152-BBGA

The EP3SE80F1152C4N is a commercial-grade Stratix® III E FPGA IC offering high-density programmable logic and on-chip memory for demanding embedded applications. It integrates 80,000 logic elements, approximately 6.84 Mbits of embedded RAM, and up to 744 I/Os in a 1152-ball BGA package.

Designed for commercial embedded systems that require significant logic capacity, abundant I/O, and flexible clocking and DSP resources, this device supports designs where integration, scalability, and performance density are priorities while operating within standard commercial temperature and voltage ranges.

Key Features

  • High-density logic — 80,000 logic elements provide substantial programmable fabric for complex custom logic, state machines, and control implementations.
  • On-chip memory — Approximately 6.84 Mbits of embedded RAM supports buffering, packet storage, and local data processing without external memory dependence.
  • Extensive I/O — Up to 744 user I/Os enable broad connectivity to peripherals, sensors, and high-pin-count interfaces within a single device.
  • Core voltage range — Core supply range from 860 mV to 1.15 V allows operation with standard low-voltage power rails for modern FPGA designs.
  • Commercial temperature and grade — Specified for 0 °C to 85 °C operation and classified as Commercial grade for mainstream embedded deployments.
  • Package and mounting — 1152-BBGA (1152-FBGA, 35×35) surface-mount package delivers a compact, board-friendly footprint for high-density PCBs.
  • Series-level system features — Device handbook references include DC/switching characteristics, PLLs, DSP block specifications, TriMatrix memory blocks, and configuration/JTAG support for robust system design.
  • RoHS compliant — Built to meet RoHS environmental requirements for lead-free assembly.

Typical Applications

  • Signal processing and DSP — On-chip DSP blocks and abundant logic/memory capacity enable real-time filtering, transforms, and accelerated numeric processing.
  • Communications infrastructure — High I/O count and flexible clocking resources support protocol interfacing, packet handling, and custom data-plane functions.
  • Embedded computing and prototyping — Large logic resource and TriMatrix memory blocks make the device suitable for system prototyping and embedded control with complex state logic.
  • Custom hardware acceleration — Use the programmable fabric and DSP resources to offload compute-intensive tasks and improve system-level throughput.

Unique Advantages

  • Significant programmable capacity: 80,000 logic elements enable integration of large custom functions and reduce the need for multiple discrete devices.
  • Integrated memory for reduced BOM: Approximately 6.84 Mbits of embedded RAM lowers dependency on external memory components for many buffering and processing tasks.
  • High I/O integration: Up to 744 I/Os simplify board-level routing for multi-interface systems and high-pin-count designs.
  • Flexible power options: Supported core voltage range (860 mV–1.15 V) aligns with modern low-voltage power architectures for efficient power delivery.
  • Commercial-ready footprint: 1152-ball BGA surface-mount package provides a compact solution compatible with standard assembly processes.
  • Series documentation and features: Device handbook coverage of PLLs, DSP blocks, clock tree, and configuration/JTAG gives designers the technical reference needed to implement complex systems.

Why Choose EP3SE80F1152C4N?

The EP3SE80F1152C4N positions itself as a high-density, commercially graded FPGA for designers requiring a balance of logic capacity, embedded memory, and extensive I/O in a single package. Its combination of 80,000 logic elements, substantial on-chip RAM, and rich series-level feature set (PLL, DSP, TriMatrix memory, configuration/JTAG) supports complex digital signal processing, protocol handling, and hardware acceleration tasks.

For engineering teams focused on scalable, integrated FPGA solutions in commercial embedded products, this Stratix® III E device provides a robust platform with documented electrical and switching characteristics to guide board-level integration and system design decisions.

If you would like pricing, availability, or to request a formal quote for EP3SE80F1152C4N, submit an inquiry or request a quote and our team will respond with the information you need to move your design forward.

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