EP3SE80F1152C4LN

The EP3SE80F1152C4LN is a Stratix® III E field-programmable gate array (FPGA) from Intel, offering a high-density programmable logic solution in a 1152‑FBGA package. It combines 80,000 logic elements with substantial on-chip RAM and a large I/O count to address complex, high-pin-count designs.

Designed for commercial-temperature applications, this device provides flexible I/O capacity and a low-voltage core supply range, making it suitable for dense digital implementations that require embedded memory and broad interfacing capability.

Key Features

• Logic Capacity — 80,000 logic elements to implement complex custom logic, state machines, and data-path functions.
• Embedded Memory — Approximately 6.84 Mbits of on-chip RAM for buffering, lookup tables, and memory-intensive logic functions.
• I/O Resources — 744 user I/O pins to support high-pin-count connectivity for parallel buses, multiple interfaces, and extensive peripheral integration.
• Package — 1152‑FBGA (35×35) surface-mount package (listed as 1152-BBGA, FCBGA in packaging data) for compact, high-density board layouts.
• Power — Core supply range of 0.86 V to 1.15 V to match system power-rail designs targeting Stratix® III E core voltages.
• Temperature and Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial applications.
• Regulatory — RoHS compliant, supporting lead-free manufacturing processes.
• Mounting — Surface-mount package suitable for modern PCB assembly flows.

Typical Applications

• High-density digital systems — Implement large combinational and sequential logic networks where extensive logic elements and embedded RAM are required.
• Multi-interface platforms — Aggregate and bridge numerous parallel and serial interfaces using the device’s 744 I/O pins for board-level system integration.
• Memory-intensive accelerators — Use the approximately 6.84 Mbits of on-chip RAM for buffering, FIFOs, and local storage in custom accelerator blocks.

Unique Advantages

• Substantial logic resources: 80,000 logic elements enable implementation of large finite-state machines, datapaths, and custom processors on a single device.
• Ample on-chip RAM: Approximately 6.84 Mbits of embedded memory reduces dependence on external RAM for many buffering and scratchpad needs.
• High I/O count: 744 I/O pins allow direct interfacing to a wide range of peripherals and parallel busses, simplifying board-level design.
• Compact BGA packaging: The 1152‑FBGA (35×35) package supports dense PCB routing while maintaining a surface-mount form factor.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to match standard commercial deployment environments.
• RoHS compliant: Supports lead-free manufacturing and environmental compliance requirements.

Why Choose EP3SE80F1152C4LN?

The EP3SE80F1152C4LN positions itself as a high-density Stratix® III E FPGA option for commercial designs that need a large number of logic elements, significant embedded memory, and broad I/O capability in a compact BGA package. Its combination of 80,000 logic elements, approximately 6.84 Mbits of on-chip RAM, and 744 I/O pins provides the building blocks for complex system integration on a single device.

This device is well suited to engineers developing dense digital systems, multi-interface boards, and memory-dependent accelerators who require a commercial-temperature FPGA with a modern surface-mount BGA footprint and RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability information for the EP3SE80F1152C4LN. Our team can provide the details you need for procurement and design planning.