EP3SE80F1152I3G

IC FPGA 744 I/O 1152FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 327 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O744Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3200Number of Logic Elements/Cells80000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits6843392

Overview of EP3SE80F1152I3G – Field Programmable Gate Array (FPGA) IC

The EP3SE80F1152I3G is an Intel Stratix III family field-programmable gate array supplied in a 1152-ball FCBGA surface-mount package. It combines high logic capacity, substantial on-chip memory, and a dense I/O count to address high-performance logic, DSP, and embedded system designs.

This device targets applications that require large programmable logic resources, flexible interfacing, and industrial temperature operation while offering a core supply range suitable for low-voltage designs.

Key Features

  • Core and Logic Approximately 80,000 logic elements for implementing complex control and datapath logic.
  • Embedded Memory Approximately 6.84 Mbits of on-chip RAM (6,843,392 total bits) for FIFOs, buffers, and scratchpad storage.
  • I/O Density 744 user I/O pins to support wide parallel interfaces and multi-channel connectivity.
  • Package and Mounting 1152-ball FCBGA (1152-FBGA, 35×35) surface-mount package optimized for high-density PCB layouts.
  • Power and Voltage Core voltage supply range 0.86 V to 1.15 V, enabling low-voltage operation options.
  • Temperature and Grade Industrial-grade device rated for operation from −40 °C to 100 °C; RoHS compliant.
  • Family-Class Reliability and Security Stratix III family features include optional 256-bit AES encryption for configuration security, CRC for configuration memory integrity, and built-in ECC for on-chip memory blocks.
  • Clocking and DSP Support Family-level support for multiple global/regional/peripheral clocks and dedicated high-speed DSP blocks for multiplier and MAC implementations.
  • Memory Interface and High-Speed I/O (family-level) Stratix III family capability includes support for high-speed external memory interfaces and modular I/O bank features such as dynamic on-chip termination and differential I/O support.

Typical Applications

  • High-Performance Networking Implement packet processing, line-card logic, and protocol bridging where high I/O density and programmable datapaths are required.
  • Digital Signal Processing Deploy DSP kernels, multiply-accumulate pipelines, and real-time filtering using the device’s dedicated DSP resources and embedded memory.
  • Memory Interface and Controller Design Use the on-chip memory and I/O resources to build DDR/DDR2/DDR3 interface logic and memory controllers for high-bandwidth systems (family-level support).
  • Industrial Control and Automation Leverage the industrial operating temperature range and high logic capacity for motor control, machine vision pre-processing, and deterministic control systems.

Unique Advantages

  • High Logic Capacity: Approximately 80,000 logic elements enable complex system integration on a single device, reducing external glue logic.
  • Substantial Embedded Memory: Approximately 6.84 Mbits of on-chip RAM provides local storage for buffering and deterministic data handling without relying solely on external memory.
  • Dense I/O Count: 744 user I/Os support parallel interfaces and multi-channel connectivity, simplifying board-level routing for I/O-heavy designs.
  • Industrial Temperature Rating: −40 °C to 100 °C operation suits deployments in factory and industrial environments.
  • Security and Reliability Features: Family-level support for AES configuration encryption, CRC, and ECC enhances protection and availability for critical designs.
  • Compact, High-Density Package: 1152-ball FCBGA (35×35) enables a small PCB footprint while maintaining signal routing density for advanced system boards.

Why Choose EP3SE80F1152I3G?

The EP3SE80F1152I3G positions itself as a high-capacity, industrial-grade FPGA option for designs that demand large programmable logic, significant on-chip memory, and flexible I/O. Its core voltage range and Stratix III family features deliver options for balancing performance and power in embedded and DSP-centric systems.

This device is well suited for engineering teams building networking, high-speed memory interface, or industrial control solutions who require device-level security, built-in reliability features, and the integration benefits of a single, dense FPGA platform backed by established family documentation and IP support.

Request a quote or submit a pricing inquiry to check availability and lead times for EP3SE80F1152I3G.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up