EP3SE80F1152I3G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 327 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 744 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3200 | Number of Logic Elements/Cells | 80000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 6843392 |
Overview of EP3SE80F1152I3G – Field Programmable Gate Array (FPGA) IC
The EP3SE80F1152I3G is an Intel Stratix III family field-programmable gate array supplied in a 1152-ball FCBGA surface-mount package. It combines high logic capacity, substantial on-chip memory, and a dense I/O count to address high-performance logic, DSP, and embedded system designs.
This device targets applications that require large programmable logic resources, flexible interfacing, and industrial temperature operation while offering a core supply range suitable for low-voltage designs.
Key Features
- Core and Logic Approximately 80,000 logic elements for implementing complex control and datapath logic.
- Embedded Memory Approximately 6.84 Mbits of on-chip RAM (6,843,392 total bits) for FIFOs, buffers, and scratchpad storage.
- I/O Density 744 user I/O pins to support wide parallel interfaces and multi-channel connectivity.
- Package and Mounting 1152-ball FCBGA (1152-FBGA, 35×35) surface-mount package optimized for high-density PCB layouts.
- Power and Voltage Core voltage supply range 0.86 V to 1.15 V, enabling low-voltage operation options.
- Temperature and Grade Industrial-grade device rated for operation from −40 °C to 100 °C; RoHS compliant.
- Family-Class Reliability and Security Stratix III family features include optional 256-bit AES encryption for configuration security, CRC for configuration memory integrity, and built-in ECC for on-chip memory blocks.
- Clocking and DSP Support Family-level support for multiple global/regional/peripheral clocks and dedicated high-speed DSP blocks for multiplier and MAC implementations.
- Memory Interface and High-Speed I/O (family-level) Stratix III family capability includes support for high-speed external memory interfaces and modular I/O bank features such as dynamic on-chip termination and differential I/O support.
Typical Applications
- High-Performance Networking Implement packet processing, line-card logic, and protocol bridging where high I/O density and programmable datapaths are required.
- Digital Signal Processing Deploy DSP kernels, multiply-accumulate pipelines, and real-time filtering using the device’s dedicated DSP resources and embedded memory.
- Memory Interface and Controller Design Use the on-chip memory and I/O resources to build DDR/DDR2/DDR3 interface logic and memory controllers for high-bandwidth systems (family-level support).
- Industrial Control and Automation Leverage the industrial operating temperature range and high logic capacity for motor control, machine vision pre-processing, and deterministic control systems.
Unique Advantages
- High Logic Capacity: Approximately 80,000 logic elements enable complex system integration on a single device, reducing external glue logic.
- Substantial Embedded Memory: Approximately 6.84 Mbits of on-chip RAM provides local storage for buffering and deterministic data handling without relying solely on external memory.
- Dense I/O Count: 744 user I/Os support parallel interfaces and multi-channel connectivity, simplifying board-level routing for I/O-heavy designs.
- Industrial Temperature Rating: −40 °C to 100 °C operation suits deployments in factory and industrial environments.
- Security and Reliability Features: Family-level support for AES configuration encryption, CRC, and ECC enhances protection and availability for critical designs.
- Compact, High-Density Package: 1152-ball FCBGA (35×35) enables a small PCB footprint while maintaining signal routing density for advanced system boards.
Why Choose EP3SE80F1152I3G?
The EP3SE80F1152I3G positions itself as a high-capacity, industrial-grade FPGA option for designs that demand large programmable logic, significant on-chip memory, and flexible I/O. Its core voltage range and Stratix III family features deliver options for balancing performance and power in embedded and DSP-centric systems.
This device is well suited for engineering teams building networking, high-speed memory interface, or industrial control solutions who require device-level security, built-in reliability features, and the integration benefits of a single, dense FPGA platform backed by established family documentation and IP support.
Request a quote or submit a pricing inquiry to check availability and lead times for EP3SE80F1152I3G.

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