EP3SE80F1152C4L

The EP3SE80F1152C4L is a Stratix® III E field programmable gate array (FPGA) offered in a 1152-BBGA (FCBGA) package. It provides high-density programmable logic combined with substantial on-chip memory and a large I/O count for commercial electronic designs.

This device targets designs that require significant logic resources, embedded memory, and flexible I/O in a surface-mount 1152-FBGA (35×35) package while operating within standard commercial temperature and core-voltage ranges.

Key Features

• Core Logic — 80,000 logic elements provide substantial programmable logic capacity for complex designs.
• Embedded Memory — Approximately 6.84 Mbits of total on-chip RAM to support buffering, lookup tables, and state storage.
• I/O Density — Up to 744 I/O pins to support wide parallel interfaces and multiple external connections.
• Power and Voltage — Core voltage supply range from 860 mV to 1.15 V to match standard FPGA power domains.
• Package & Mounting — 1152-BBGA FCBGA (supplier package: 1152-FBGA 35×35) in a surface-mount form factor for compact PCB integration.
• Operational Grade — Commercial-grade device specified for operation from 0°C to 85°C.
• Regulatory — RoHS compliant for environmental conformance.

Typical Applications

• High-density logic systems — For designs that require up to 80,000 logic elements to implement complex, custom logic functions.
• Memory-intensive implementations — For applications that need approximately 6.84 Mbits of embedded memory for buffering and on-chip data storage.
• I/O-rich designs — For systems requiring up to 744 I/O lines in a compact 1152-FBGA package.

Unique Advantages

• High logic capacity: 80,000 logic elements enable substantial functional integration within a single FPGA.
• Significant embedded memory: Approximately 6.84 Mbits of on-chip RAM reduce dependence on external memory for many designs.
• Large I/O count: 744 I/O pins support broad interfacing options and parallel connectivity.
• Compact surface-mount package: 1152-FBGA (35×35) package balances high pin count with a space-efficient PCB footprint.
• Commercial operating range: Rated for 0°C to 85°C to meet typical commercial deployment requirements.
• RoHS compliant: Conforms to environmental regulations for lead-free assembly.

Why Choose EP3SE80F1152C4L?

The EP3SE80F1152C4L combines high-density programmable logic, substantial embedded memory, and a large I/O capability in a surface-mount 1152-FBGA package, making it suitable for commercial designs that require integration of complex digital functions. Its voltage and temperature specifications align with standard commercial system designs.

This device is appropriate for engineers and procurement teams building designs that need scalable logic capacity, on-chip memory, and broad interfacing in a compact form factor while meeting RoHS requirements.

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