EP3SE80F1152C3N

The EP3SE80F1152C3N is a Stratix® III family field-programmable gate array provided in a 1152-BBGA (FCBGA) package. It delivers a high logic capacity and extensive I/O count in a surface-mount, commercial-grade device.

With approximately 80,000 logic elements, about 6.84 Mbits of embedded memory and up to 744 I/O pins, this device targets logic-dense, high-pin-count designs that require significant on-chip memory and flexible I/O resources while operating within a commercial temperature range.

Key Features

• Logic fabric  Approximately 80,000 logic elements to implement complex, customizable digital logic.
• Embedded memory  Approximately 6.84 Mbits of on-chip RAM (6,843,392 bits) for buffering, lookup tables and data storage.
• I/O density  Up to 744 dedicated I/O pins to support wide parallel buses and multiple interface channels.
• Package and mounting  1152-BBGA FCBGA package (supplier package listed as 1152-FBGA, 35×35) with surface-mount mounting.
• Power  Core supply voltage range from 0.860 V to 1.15 V to match system power domains.
• Operating conditions  Commercial grade rating with an operating temperature range of 0 °C to 85 °C.
• Standards and architecture features (Stratix III family)  The Stratix III device family includes architectural features documented in the device handbook such as TriMatrix embedded memory blocks, DSP blocks, clock networks and PLLs, high-speed differential I/O interfaces with DPA, configuration and remote system upgrade capabilities, IEEE 1149.1 (JTAG) boundary-scan testing, design security and SEU mitigation strategies.
• RoHS compliant  Device is compliant with RoHS requirements.

Typical Applications

• Logic-dense FPGA designs  Implement large custom state machines, control engines or glue logic using approximately 80,000 logic elements.
• Memory-intensive processing  Use the device's approximately 6.84 Mbits of embedded memory for buffering, FIFOs and local data storage.
• High-pin-count interface systems  Deploy the 744 I/O pins for wide parallel buses, multi-channel data capture or extensive peripheral connectivity.

Unique Advantages

• High integration density: Large logic capacity and substantial on-chip memory reduce the need for multiple discrete devices.
• Extensive I/O resources: 744 I/Os enable complex interfacing and high channel counts without external I/O expanders.
• Compact, manufacturable package: 1152-BBGA (35×35) surface-mount package supports high-pin-count designs in a single-package solution.
• Flexible power domain support: Core supply range (0.860–1.15 V) accommodates system power architectures and regulator choices.
• Series-level system features: Stratix III family features such as embedded DSP blocks, PLLs and JTAG boundary-scan support help streamline timing, signal processing and test integration.
• Compliance-ready: RoHS compliance supports environmental and manufacturing requirements.

Why Choose EP3SE80F1152C3N?

The EP3SE80F1152C3N offers a balance of high logic capacity, significant on-chip memory and a very high I/O count in a single, commercial-grade Stratix III FPGA package. It is suited to designs that require dense programmable logic, substantial embedded RAM and broad interfacing capabilities within a standard commercial operating range.

This device is appropriate for engineers and teams building systems that prioritize integration and I/O bandwidth while leveraging the Stratix III family architecture and series-level features documented in the device handbook.

Request a quote or submit a request for pricing and availability to evaluate the EP3SE80F1152C3N for your next design.