EP3SE110F780I4G

The EP3SE110F780I4G is an Intel Stratix III family FPGA supplied in a 780-ball FCBGA package for surface-mount assembly. It combines high logic capacity, significant on-chip memory, and a broad I/O complement to support high-performance logic, DSP and embedded designs in industrial environments.

Designed for systems that require high integration and robust operation, the device offers a core supply range of 0.86 V to 1.15 V and an industrial operating temperature range from −40 °C to 100 °C.

Key Features

• Logic Capacity  Approximately 107,500 logic elements for implementing complex control, signal processing and protocol logic.
• Embedded Memory  Approximately 8.94 Mbits of on-chip RAM to support FIFOs, buffers and on-device data storage.
• I/O and Packaging  488 user I/O pins in a 780-ball FCBGA (780-FBGA, 29×29) surface-mount package to accommodate high-pin-count system interfaces.
• Power and Voltage  Core supply range from 860 mV to 1.15 V; family-level power innovations such as Programmable Power Technology are documented in the Stratix III device handbook.
• Operating Range and Compliance  Industrial-grade operating temperature (−40 °C to 100 °C) and RoHS compliance for regulated manufacturing environments.
• Family-Level Timing & Clocking  Stratix III family features include extensive clock resources and multiple PLLs for complex clocking schemes (see Stratix III documentation for details).
• Security & Reliability  Stratix III family features include optional 256-bit AES encryption and configuration memory integrity checks such as CRC and ECC to support higher-availability designs.

Typical Applications

• High-Performance DSP and Signal Processing  Use the device’s large logic fabric and embedded memory to implement FIR filters, FFTs and other real-time signal processing algorithms.
• Communications and Networking  High pin-count I/O and Stratix III family SERDES/I/O capabilities support protocol bridging, packet processing and interface adaptation in networking equipment.
• Memory Interface Controllers  On-chip memory and configurable I/O banks suit applications requiring DDR/DDR2/DDR3 or specialized SRAM interfaces.
• Industrial Control and Automation  Industrial temperature rating, high integration and flexible I/O make the device suitable for motor control, motion systems and factory automation controllers.
• Embedded Systems  Large logic and memory resources support custom processors, peripheral integration and real-time control functions.

Unique Advantages

• High logic density: Approximately 107,500 logic elements reduce the need for multiple devices and simplify system partitioning.
• Substantial on-chip memory: Approximately 8.94 Mbits of embedded RAM enables deep buffering and data-path-intensive designs without external memory in some use cases.
• Robust I/O in a compact package: 488 user I/Os in a 780-ball FCBGA provide a high pin count while maintaining a compact board footprint.
• Industrial temperature range: −40 °C to 100 °C rating supports deployment in harsh or temperature-variable environments.
• Industry-standard compliance: RoHS compliance simplifies integration into regulated manufacturing processes.
• Family-level reliability and security: Stratix III family features such as ECC for memory blocks, CRC for configuration memory, and optional AES encryption help protect critical designs.

Why Choose EP3SE110F780I4G?

The EP3SE110F780I4G delivers a balanced combination of logic capacity, embedded memory and high-density I/O in a single industrial-grade FPGA package. Its specifications make it appropriate for engineers building high-performance DSP, networking, memory-interface and embedded control systems that require on-chip resources and reliable operation across a wide temperature range.

Picking this device gives designers access to Stratix III family capabilities—extensive clocking, power-management approaches, reliability and security features—enabling scalable designs with long-term support from Intel’s FPGA documentation and ecosystem.

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