EP3SE110F780I3N

The EP3SE110F780I3N is a Stratix® III E FPGA from Intel, providing a high-capacity, reprogrammable logic platform in a 780-ball FCBGA package. With 107,500 logic elements, approximately 8.94 Mbits of embedded RAM and 488 user I/Os, it is aimed at industrial designs that require dense logic implementation, substantial on-chip memory and broad I/O connectivity.

Built for industrial environments, the device supports a wide operating temperature range and a low-voltage core supply, enabling integration into systems that demand reliability, high integration density and flexible hardware acceleration.

Key Features

• Logic Capacity  107,500 logic elements for complex combinatorial and sequential designs.
• Embedded Memory  Approximately 8.94 Mbits of on-chip RAM to support buffering, state storage and local data processing.
• I/O and Connectivity  488 user I/Os to enable wide external interfacing and multi-channel system integration.
• Power  Core voltage supply range from 0.86 V to 1.15 V to match system power architectures and optimize power delivery.
• Package and Mounting  780-ball FBGA (29 × 29) surface-mount package for compact, high-density board integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial-grade environments.
• Standards Compliance  RoHS compliant for material and environmental conformity.

Typical Applications

• Industrial Control and Automation  Implement real-time control logic and I/O aggregation across a wide temperature range using the device's high logic capacity and 488 I/Os.
• Embedded Data Processing  Use the approximately 8.94 Mbits of embedded RAM and large logic fabric for buffering, packet handling and application-specific processing blocks.
• Protocol Bridging and Custom Interfaces  Deploy multiple custom protocol engines and interface logic leveraging the high I/O count and reprogrammable logic resources.

Unique Advantages

• High Logic Density: 107,500 logic elements provide headroom for complex algorithms and multi-function designs without immediate board-level expansion.
• Substantial On-Chip Memory: Approximately 8.94 Mbits of RAM reduces dependency on external memory for many buffering and stateful tasks.
• Extensive I/O Resources: 488 user I/Os simplify integration with peripherals, sensors and multi-channel interfaces.
• Industry-Grade Thermal Range: −40 °C to 100 °C rating supports deployments in industrial environments with wider ambient temperature swings.
• Compact, High-Density Package: 780-FBGA (29 × 29) enables space-efficient PCB designs while supporting high-pin-count connectivity.
• Low-Voltage Core Operation: 0.86 V to 1.15 V core supply options help align the device with modern low-voltage system power domains.

Why Choose EP3SE110F780I3N?

The EP3SE110F780I3N positions itself as a high-capacity, industrial-grade FPGA solution that combines a large logic fabric, substantial embedded memory and wide I/O counts in a compact 780-ball FCBGA package. These characteristics make it suitable for engineers building dense, reconfigurable systems where integration density and operating temperature resilience are essential.

Manufactured by Intel, this device is targeted at designs that require scalable logic resources and robust on-chip memory while meeting industrial temperature and RoHS requirements—delivering a balance of integration and reliability for long-term deployment.

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