EP3SE110F780C4N

The EP3SE110F780C4N is a Stratix® III E Field Programmable Gate Array (FPGA) from Intel, offering high logic density and substantial on-chip memory in a ball-grid array package. With 107,500 logic elements, approximately 8.9 Mbits of embedded memory, and 488 I/Os, this device is targeted at designs that require large programmable logic resources and significant I/O connectivity within a commercial-temperature range.

Key Features

• Core Logic 107,500 logic elements and 4,300 logic blocks provide the programmable fabric for complex digital designs and high-density logic integration.
• Embedded Memory Approximately 8.9 Mbits of total on-chip RAM to support buffering, FIFOs, and data-path storage without external memory for many use cases.
• I/O Capacity 488 general-purpose I/Os enable extensive interfacing to peripherals, high-pin-count systems, and multi-channel interfaces.
• Power Supply Range Core voltage support from 860 mV to 1.15 V provides flexibility for power-domain planning and system-level power management.
• Package & Mounting 780-BBGA FCBGA package (supplier device package: 780-FBGA (29x29)) in a surface-mount form factor for compact board layouts and high-pin-count deployments.
• Temperature & Grade Commercial-grade device specified for 0 °C to 85 °C operation, suitable for standard commercial applications and environments.
• RoHS Compliance Device is RoHS compliant to meet common environmental directives for lead-free assembly.

Typical Applications

• High-density digital processing — Large logic capacity and embedded RAM support complex datapath implementations and custom accelerators.
• Communications and networking — Extensive I/O and on-chip memory enable packet processing, framing, and interface bridging in network equipment.
• Embedded systems and prototyping — The combination of logic, memory, and I/O makes this FPGA suitable for system-level prototyping and feature-rich embedded designs.

Unique Advantages

• High logic integration: 107,500 logic elements reduce the need for multiple discrete programmable devices, simplifying board design.
• Substantial on-chip RAM: Approximately 8.9 Mbits of embedded memory supports internal buffering and data manipulation without immediate external memory dependence.
• Extensive I/O count: 488 I/Os allow direct connection to a wide range of peripherals and high-pin-count interfaces, reducing glue logic.
• Compact, high-pin-count package: 780-BBGA FCBGA packaging in a surface-mount form factor enables dense PCB layouts while maintaining signal access.
• Commercial temperature range: Specified 0 °C to 85 °C operation for deployment in standard commercial environments.
• Environmental compliance: RoHS compliance supports lead‑free manufacturing requirements.

Why Choose EP3SE110F780C4N?

The EP3SE110F780C4N positions itself as a high-density, commercial-grade FPGA solution for designs that demand large programmable logic resources, significant embedded memory, and broad I/O capability. Its combination of 107,500 logic elements, roughly 8.9 Mbits of on-chip RAM, and 488 I/Os makes it well suited for complex digital processing, communications interfaces, and system-level prototyping where integration and I/O count matter.

Choose this FPGA when your design requires substantial on-chip resources in a surface-mount 780-BBGA package and when operation across standard commercial temperatures and RoHS-compliant assembly are required.

Request a quote or submit an inquiry for pricing and availability of the EP3SE110F780C4N to get detailed lead-time and purchasing information.