EP3SE110F780C4G

The EP3SE110F780C4G is an Intel Stratix III family FPGA offering a high-performance, low-power programmable fabric for compute- and memory-intensive embedded designs. This device combines a substantial logic capacity with multi-megabit on-chip memory and a broad set of I/O resources to address DSP, networking, and high-performance logic applications.

Designed for commercial-grade systems, the device supports selectable core voltage operation and on-chip features drawn from the Stratix III architecture to balance performance and power across a wide range of system requirements.

Key Features

• Logic Capacity — 107,500 logic elements to implement complex custom logic, control, and signal processing functions.
• Embedded Memory — Approximately 8.9 Mbits of on-chip RAM for FIFOs, buffers, and memory-mapped storage to support data-centric designs.
• I/O Resources — 488 user I/O pins arranged for flexible interfacing with external devices and memory subsystems.
• Programmable Power and Core Voltage — Core voltage supported from 0.86 V to 1.15 V with Stratix III programmable power features to help optimize performance versus power.
• High-speed I/O Support — Stratix III-family features include SERDES and dynamic phase alignment circuitry with documented high-speed differential I/O capabilities suitable for demanding communications links.
• System Reliability and Security — Family-level features include optional 256-bit AES encryption for configuration security and built-in error detection/ECC mechanisms for configuration and memory integrity.
• Clocking and DSP Support — Family architecture includes multiple PLLs and extensive clock resources plus high-speed DSP block support (as described for the Stratix III family) for signal processing workloads.
• Package — 780-ball FCBGA package (780-FBGA, 29 × 29 mm) suitable for surface-mount assembly in compact high-density designs.
• Commercial Temperature and Compliance — Rated for 0 °C to 85 °C operating temperature and RoHS compliant.

Typical Applications

• High-performance DSP and Signal Processing — Implement multi-stage filters, FFT engines, and custom arithmetic using the device’s logic and on-chip memory resources.
• Network and Communications Systems — Use the device’s high-speed differential I/O and SERDES capabilities to implement protocol engines and packet-processing pipelines.
• Memory Interface and Buffering — Leverage the embedded RAM and abundant I/O to build controllers and buffering for external DDR/DRAM or other high-speed memories.
• ASIC Prototyping and Custom Logic — Replace or validate custom ASIC functions with a programmable Stratix III FPGA to accelerate development and reduce time-to-market.

Unique Advantages

• High Logic Density: 107,500 logic elements provide the capacity to integrate complex system functions on a single device, reducing component count.
• Multi-Megabit Embedded Memory: Approximately 8.9 Mbits of on-chip RAM enable deep buffering and local data storage to support high-throughput designs.
• Significant I/O Count: 488 user I/Os allow flexible interfacing to external peripherals, memory, and high-speed links without excessive board-level multiplexing.
• Configurable Power/Performance Trade-offs: Core voltage support from 0.86 V to 1.15 V and Stratix III programmable power features help tune the device for target performance or lower power operation.
• Robust Security and Reliability Options: Family-level AES encryption for configuration and ECC/error detection for memory and configuration bits support higher system availability and IP protection strategies.
• Compact, Surface-Mount Package: 780-FBGA (29 × 29 mm) enables deployment in space-constrained boards while maintaining thermal and signal integrity considerations for high-density designs.

Why Choose EP3SE110F780C4G?

The EP3SE110F780C4G positions itself as a capable Stratix III FPGA option for designers who need a balance of logic density, embedded memory, and substantial I/O in a commercial-grade device. Its combination of 107,500 logic elements, roughly 8.9 Mbits of on-chip RAM, and high-speed I/O support suits data-centric and DSP-focused systems that require programmable flexibility and integration.

Backed by the Stratix III family architecture and Intel’s ecosystem support for megafunctions and embedded processor integration, this device is appropriate for teams targeting high-performance prototypes, communications endpoints, and advanced embedded platforms where performance, configurability, and design scalability are priorities.

Request a quote or submit a sales inquiry to learn more about availability, lead times, and volume pricing for EP3SE110F780C4G.