EP3SE110F780C4LN

The EP3SE110F780C4LN is a Stratix® III E field programmable gate array (FPGA) from Intel, designed for commercial-grade applications that require high logic density and substantial on-chip memory. With 107,500 logic elements and approximately 8.94 Mbits of embedded RAM, this device targets complex digital designs that need extensive programmable logic, memory resources, and a large number of I/O signals.

Packaged in a 780-ball FCBGA (29 × 29) and specified for surface-mount assembly, the device delivers a compact, high-density integration option operating from 0 °C to 85 °C and a core supply range of 0.86 V to 1.15 V.

Key Features

• Core Logic 107,500 logic elements (cells) provide a high-capacity programmable fabric for implementing complex state machines, control logic, and custom datapaths.
• Embedded Memory Approximately 8.94 Mbits of on-chip RAM to support buffering, FIFOs, and other memory-intensive functions without external memory dependence.
• I/O Density 488 user I/O pins enable broad interfacing options for parallel buses, high-pin-count peripherals, and multi-channel I/O systems.
• Package & Mounting 780-BBGA/FCBGA package (supplier package: 780-FBGA 29×29) optimized for space-efficient surface-mount integration on compact PCBs.
• Power Core supply voltage range of 0.86 V to 1.15 V allows designs to target specific power-performance envelopes.
• Commercial Temperature Grade Specified operating range of 0 °C to 85 °C suitable for standard commercial applications.
• Compliance RoHS-compliant construction supports regulatory requirements for lead-free assemblies.

Typical Applications

• High-density digital systems — Implement complex control logic, protocol engines, and custom accelerators using the large logic element count and embedded RAM.
• Multi-channel I/O platforms — Drive and aggregate numerous external interfaces and sensors with 488 available I/Os for parallel and multi-signal applications.
• Embedded memory-centric designs — Use the on-chip RAM for buffering, data staging, and small shared-memory tasks that minimize external memory needs.
• Compact, surface-mount assemblies — The 780-ball FCBGA package supports high-density PCB layouts where board space and pin count are critical.

Unique Advantages

• Substantial logic capacity: 107,500 logic elements enable large-scale, integrated digital designs without partitioning across multiple devices.
• Significant on-chip memory: Approximately 8.94 Mbits of embedded RAM reduces dependency on external memory, simplifying BOM and board routing.
• High I/O count: 488 I/Os provide flexible interface options for multi-channel connectivity and complex peripheral integration.
• Space-efficient package: 780-ball FCBGA (29×29) delivers high pin density in a compact footprint for space-constrained designs.
• Commercial-grade reliability: Specified 0 °C to 85 °C operating range and RoHS compliance fit standard commercial product requirements.

Why Choose EP3SE110F780C4LN?

The EP3SE110F780C4LN combines high logic element density, substantial embedded RAM, and a large I/O complement in a compact FCBGA package, making it well suited to commercial designs that require integrated programmable logic and memory resources. Its specified voltage range and commercial temperature rating allow designers to optimize power and thermal profiles for standard operating environments.

Ideal for engineering teams building complex digital controllers, multi-interface platforms, or memory-intensive embedded systems, this Stratix® III E FPGA offers a balanced mix of capacity and integration to support scalable designs and reduce external component count.

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