EP3SE110F780C4L

The EP3SE110F780C4L is a Stratix® III E field programmable gate array designed to implement custom digital logic in compact, surface-mount form. It combines a high logic capacity with significant on-chip memory and a large I/O complement to support complex system designs.

Targeted at commercial-temperature applications, this FCBGA-packaged device offers designers a balance of integration, measurable power characteristics, and a robust pin count for diverse interface needs.

Key Features

• Core Logic 107,500 logic elements provide a substantial fabric for implementing wide-ranging digital functions and complex control logic.
• Embedded Memory Approximately 8.94 Mbits of on-chip RAM for buffering, state storage, and intermediate processing without external memory dependency.
• I/O Capacity 488 user I/O pins enable extensive system interfacing for high-pin-count designs and multi-channel connectivity.
• Power Domain Core supply range of 860 mV to 1.15 V supports low-voltage operation consistent with modern digital power architectures.
• Package and Mounting 780-BBGA / FCBGA package in a 780-FBGA (29×29) footprint for surface-mount assembly in space-constrained board layouts.
• Operating Conditions Commercial grade operation from 0 °C to 85 °C and RoHS compliance suitable for standard commercial applications.

Typical Applications

• Custom Digital and Control Logic Implement complex state machines, protocol handlers, and application-specific acceleration using the dense logic fabric and embedded memory.
• Signal Processing and Data Handling Use on-chip RAM and abundant logic to perform buffering, preprocessing, and deterministic data-flow tasks in real-time systems.
• High-Channel I/O Systems Leverage 488 I/O pins for multi-interface boards, sensor arrays, or I/O-rich embedded platforms where parallel connectivity is required.

Unique Advantages

• High Integration Density: 107,500 logic elements allow consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial On-Chip Memory: Approximately 8.94 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O Count: 488 user I/Os provide flexibility for routing multiple interfaces and peripherals directly to the FPGA.
• Low-Voltage Core Compatibility: 860 mV to 1.15 V supply range enables integration with low-voltage system power rails.
• Compact Surface-Mount Package: 780-FBGA (29×29) packaging supports high-density PCB layouts while maintaining robust pin availability.
• Commercial-Grade and RoHS Compliant: Designed for commercial operating temperatures and environmental compliance for mainstream applications.

Why Choose EP3SE110F780C4L?

The EP3SE110F780C4L positions itself as a high-capacity, commercially graded FPGA option for designs that require substantial logic resources, embedded memory, and broad I/O connectivity in a compact surface-mount package. Its combination of 107,500 logic elements, approximately 8.94 Mbits of RAM, and 488 I/Os makes it well suited for developers building complex digital systems at commercial temperatures.

For engineering teams and procurement seeking a programmable, high-density solution that supports extensive on-chip resources and flexible interfacing, this Stratix® III E device delivers a practical balance of integration and specification-driven predictability for production designs.

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