EP3SE110F780I4

The EP3SE110F780I4 is a Stratix® III E Field Programmable Gate Array (FPGA) from Intel, offered in a 780-FBGA (29×29) surface-mount package. It delivers high logic density, substantial embedded RAM, and a large I/O count in an industrial-grade device targeted at designs that require robust thermal range and high integration.

Built for applications that need on-chip memory and connectivity in a compact FCBGA package, this device combines 107,500 logic elements with approximately 8.94 Mbits of embedded memory and 488 I/Os to support complex, high-pin-count system implementations.

Key Features

• Core Logic 107,500 logic elements provide the programmable fabric for implementing complex digital functions and custom logic architectures.
• Embedded Memory Approximately 8.94 Mbits of on-chip RAM to support large buffers, state machines, and memory-intensive logic blocks.
• I/O Density 488 user I/Os to accommodate wide parallel interfaces, multiple peripherals, and high-pin-count connectivity needs.
• Power Supply Core supply voltage range of 860 mV to 1.15 V to match system power-domain requirements.
• Package & Mounting 780-BBGA, FCBGA package (supplier device package: 780-FBGA, 29×29) in a surface-mount form factor for compact board-level integration.
• Temperature Range & Grade Industrial-grade device with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Standards Compliance RoHS compliant.

Unique Advantages

• High integration density: 107,500 logic elements enable consolidated implementation of complex digital subsystems, reducing external component count.
• Substantial on-chip memory: Approximately 8.94 Mbits of embedded RAM supports large buffering and memory-centric logic without immediate external memory dependence.
• Extensive I/O capability: 488 I/Os provide flexibility for multiple interfaces, parallel buses, and high-pin-count peripherals on a single device.
• Industrial operating window: Rated for −40 °C to 100 °C, suitable for industrial environments where extended temperature tolerance is required.
• Compact FCBGA packaging: 780-FBGA (29×29) surface-mount package enables dense PCB implementations while maintaining broad I/O and logic resources.
• Controlled core voltage range: 860 mV to 1.15 V core supply allows precise power-domain design and compatibility with systems using similar core voltages.

Why Choose EP3SE110F780I4?

The EP3SE110F780I4 positions itself as a high-density, industrial-grade FPGA option for engineers who need a combination of large logic capacity, significant embedded memory, and a high count of I/Os in a compact FCBGA package. Its specifications make it appropriate for designs requiring robust thermal performance and high integration on board space-constrained layouts.

For projects that demand scalability in logic and memory resources while maintaining industrial temperature capability and a defined core voltage range, this Stratix III E device offers a clear, specification-driven choice.

If you would like pricing, availability, or to request a formal quote for the EP3SE110F780I4, please submit a quote request or contact sales to initiate the process.