EP3SE110F1152C2G

The EP3SE110F1152C2G is an Intel Stratix III family FPGA delivered in a 1152-ball FCBGA package, designed for high-performance logic, DSP and memory-centric embedded applications. It combines 107,500 logic elements with abundant on-chip memory and a large I/O count to support complex system integration and high-bandwidth interfaces.

Targeted at commercial applications, this device offers selectable core voltage operation and family-level features such as advanced clocking, PLLs, and on-chip reliability functions to support demanding digital signal processing and system-control tasks.

Key Features

• Logic Capacity — 107,500 logic elements to implement complex combinational and sequential logic, state machines, and custom accelerators.
• Embedded Memory — Approximately 8.94 Mbits of on-chip RAM for buffering, FIFOs, and local data storage to support data-centric designs.
• High I/O Count — 744 user I/O pins in modular I/O banks to support wide parallel buses and diverse interface standards.
• Advanced Clocking and PLLs — Family support for multiple global and regional clocks and up to 12 PLLs for flexible clock synthesis and phase control.
• DSP and Multiplier Support — Stratix III family DSP block architecture for multiply-accumulate and FIR implementations as part of high-performance signal processing flows.
• Signal Integrity and High‑Speed I/O — Family features include dynamic on‑chip termination, output delay and current strength control, and SERDES/DPA circuitry for high-speed differential links.
• Power and Voltage — Core voltage selectable within the range 0.86 V to 1.15 V to balance performance and power for the target design.
• Package and Mounting — 1152-BBGA (FCBGA) surface-mount package; supplier package: 1152-FBGA (35×35) for compact board-level integration.
• Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Reliability and Security — Family-level features include configuration CRC and ECC for memory blocks and optional AES-based configuration security.
• Regulatory — RoHS compliant.

Typical Applications

• High-Performance Signal Processing — DSP blocks and large logic fabric enable implementations of FIR filters, FFTs, and custom accelerators for communications and instrumentation.
• Memory-Intensive Systems — Substantial embedded RAM supports buffering and controller logic for DDR/DDR2/DDR3 and other high-bandwidth memory interfaces.
• Networking and Communications — High I/O count and SERDES-capable I/O banks make the device suitable for protocol bridging, packet processing, and line card functions.
• Embedded System Integration — Flexible clocking, PLLs, and abundant logic elements enable implementation of SoC-style glue logic, peripheral controllers, and custom processors.

Unique Advantages

• High Logic Density: 107,500 logic elements provide the headroom needed for complex, multi-function designs without immediate migration to larger devices.
• Significant On-Chip Memory: Approximately 8.94 Mbits of embedded RAM reduces external memory dependence for many buffering and packetization tasks.
• Large, Flexible I/O Resource: 744 user I/Os in modular banks simplify routing of wide buses and support mixed signaling standards across the board.
• Configurable Power/Performance Trade-offs: Core supply range from 0.86 V to 1.15 V allows designers to tune for higher performance or lower power within the supported operating window.
• Commercial Temperature Compatibility: Designed for 0 °C to 85 °C operation suitable for a wide range of commercial electronics and embedded systems.
• RoHS Compliance: Meets RoHS requirements to support environmentally conscious product development.

Why Choose EP3SE110F1152C2G?

The EP3SE110F1152C2G combines a large logic fabric, substantial embedded memory, and a high I/O count in a compact 1152-ball FCBGA package to address demanding commercial applications in signal processing, networking, and embedded integration. Its family-level features—advanced clocking, PLL support, DSP resources, and on-chip reliability mechanisms—enable designers to implement robust, high-throughput systems while managing power and board-level complexity.

This device is well suited for engineering teams building complex FPGA-based subsystems that require a balance of logic capacity, memory, and flexible I/O in a commercially graded component backed by Intel’s Stratix III family capabilities.

Request a quote or submit a pricing inquiry to begin evaluating EP3SE110F1152C2G for your next design. Our team can provide availability and lead-time information tailored to your project needs.