EP3CLS70U484I7

The EP3CLS70U484I7 is a Cyclone® III family field-programmable gate array (FPGA) in a 484-FBGA package designed for low-power, high-functionality designs. It provides 70,208 logic elements, approximately 3.07 Mbits of embedded memory, and 278 general-purpose I/Os, making it suitable for high-volume, power-sensitive and integration-focused applications.

As a Cyclone III device, it benefits from the family’s low-power process optimizations and system integration features—targeting applications that require a balance of logic density, on-chip memory, and robust I/O in an industrial-temperature product.

Key Features

• Logic Capacity 70,208 logic elements to implement complex combinational and sequential logic functions.
• Embedded Memory Approximately 3.07 Mbits of on-chip RAM for buffering, FIFOs and local data storage.
• I/O Count and Packaging 278 user I/Os in a 484-FBGA (supplier package: 484-UBGA, 19×19) surface-mount package for dense PCB integration.
• Voltage and Power Core supply range of 1.15 V to 1.25 V, aligned with low-power Cyclone III family operation.
• Industrial Temperature Range Rated for operation from –40 °C to 100 °C for thermally demanding environments.
• Mounting and Compliance Surface-mount package and RoHS-compliant construction for modern assembly processes and regulatory compliance.
• Cyclone III Family Features Family-level capabilities include low-power silicon optimizations, on-chip clock management (family specifies up to four PLLs per device), and a wide collection of pre-built IP cores and embedded processor support referenced for Cyclone III devices.

Typical Applications

• Industrial Control FPGA-based motion and process control where robust I/O, on-chip RAM, and industrial temperature operation are required.
• Embedded Systems Local signal processing and glue-logic for systems requiring moderate logic capacity and integrated memory.
• Portable and Low-Power Products Designs that benefit from Cyclone III family low-power characteristics to extend battery life or reduce cooling requirements.
• Communications and Networking I/O-dense front-end functions, protocol bridging, and buffering using plentiful I/O and embedded RAM.

Unique Advantages

• Highly integrated logic and memory: 70,208 logic elements paired with approximately 3.07 Mbits of embedded memory reduce external component needs and simplify board design.
• Dense I/O in a compact package: 278 I/Os in a 484-FBGA (19×19) package supports high pin-count interfaces while preserving PCB real estate.
• Designed for low power: Built on Cyclone III low-power process optimizations to help meet power budgets in battery-operated and thermally constrained systems.
• Industrial temperature rating: –40 °C to 100 °C operation enables reliable use in harsh or outdoor environments.
• System-level features available in the family: On-chip clock management and a broad IP ecosystem (including embedded processor options referenced for Cyclone III) accelerate development and reduce time to market.

Why Choose EP3CLS70U484I7?

The EP3CLS70U484I7 offers a balanced combination of logic density, embedded memory, and a high I/O count in an industrial-temperature Cyclone III FPGA. Its 70,208 logic elements and approximately 3.07 Mbits of on-chip RAM make it well suited for designs that require substantial local processing and buffering without extensive external components.

Designed within the Cyclone III family, it leverages low-power silicon optimizations and a family ecosystem of IP and clocking resources to reduce development time and support scalable design migration across device densities.

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