EP3CLS70U484C8

The EP3CLS70U484C8 is an Intel Cyclone® III family field-programmable gate array supplied in a 484-FBGA (484-UBGA, 19×19) package for surface-mount assembly. This device delivers a balance of logic capacity, embedded memory, and I/O density targeted at high-volume, low-power, cost-sensitive applications.

With 70,208 logic elements and approximately 3.07 Mbits of on-chip RAM, the device is suited for designs that require substantial programmable logic and local memory while maintaining a modest power and thermal footprint. The device operates from a 1.15 V to 1.25 V core supply and is specified for commercial temperature operation (0 °C to 85 °C).

Key Features

• Logic Capacity  The device provides 70,208 logic elements to implement complex digital functions and custom processing pipelines.
• Embedded Memory  Approximately 3.07 Mbits of on-chip RAM supports buffering, FIFOs, and local data storage without requiring external memory for many use cases.
• I/O Resources  278 user I/Os in the 484-FBGA package enable high connectivity for interfaces, sensors, and peripheral subsystems.
• Power and Core Voltage  Designed for low-power operation with a core supply range of 1.15 V to 1.25 V, supporting power-sensitive system designs.
• Package and Mounting  484-FBGA (484-UBGA, 19×19) surface-mount package delivers a compact footprint for high-density board layouts.
• Operating Range and Grade  Commercial-grade device specified for 0 °C to 85 °C operation.
• Compliance  RoHS compliant, meeting common environmental and manufacturing requirements.
• Cyclone III Family Capabilities  As part of the Cyclone III family, the device benefits from low-power process technology and device-level features such as multiple PLLs for clock management and a broad set of supported I/O standards (as documented in Cyclone III family literature).

Typical Applications

• High-volume embedded systems  Cost-sensitive consumer and portable products that require programmable logic and on-chip memory while minimizing BOM complexity and power consumption.
• Communications interfaces  Implement protocol bridging, packet buffering, and custom I/O handling using the device’s abundant I/Os and embedded RAM.
• Industrial control and automation  Control logic, sensor interfacing, and real-time signal routing where 70,208 logic elements and flexible I/O mapping are advantageous (commercial temperature range).
• Custom logic acceleration  Offload application-specific processing tasks to on-chip logic and memory to reduce latency and external component needs.

Unique Advantages

• Significant on-chip capacity: 70,208 logic elements combined with approximately 3.07 Mbits of embedded memory reduce reliance on external logic and RAM, simplifying board design.
• High I/O density: 278 user I/Os in a 484-FBGA footprint supports complex interconnects and multiple peripheral interfaces without large packages.
• Low-power family heritage: Built on the Cyclone III family’s low-power process foundations, the device is designed for power-conscious designs and extended operational efficiency.
• Compact, surface-mount package: The 484-UBGA (19×19) package offers a small PCB footprint with high pin count for compact system designs.
• Commercial temperature rating: Specified for 0 °C to 85 °C operation, matching many mainstream embedded and consumer system requirements.
• RoHS compliant: Meets common environmental manufacturing requirements for global production.

Why Choose EP3CLS70U484C8?

The EP3CLS70U484C8 positions itself for designs that require a sizeable programmable-logic fabric and embedded memory in a compact, surface-mount FBGA package. Its combination of 70,208 logic elements, roughly 3.07 Mbits of on-chip RAM, and 278 I/Os offers a practical balance of integration and flexibility for cost-sensitive, power-aware applications.

As a member of the Cyclone III device family, this FPGA benefits from a family-level feature set geared toward low power and system integration, making it appropriate for teams looking to scale designs across varying device densities while leveraging available Cyclone III tools and IP resources.

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