EP3CLS70U484C7N

IC FPGA 278 I/O 484UBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 278 3068928 70208 484-FBGA

Quantity 277 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-FBGANumber of I/O278Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4388Number of Logic Elements/Cells70208
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3068928

Overview of EP3CLS70U484C7N – Cyclone® III Field Programmable Gate Array (FPGA) IC 278 3068928 70208 484-FBGA

The EP3CLS70U484C7N is a Cyclone III family FPGA from Intel, offering a mid-range programmable logic platform with 70,208 logic elements and approximately 3.07 Mbits of embedded memory. Designed for commercial applications, this surface-mount device provides 278 user I/Os in a 484-FBGA package (484-UBGA, 19×19) and operates from a 1.15 V to 1.25 V core supply across a 0 °C to 85 °C temperature range.

Built on the Cyclone III device family architecture, the device targets cost- and power-sensitive designs that require substantial logic density, on-chip memory, and flexible I/O and clocking resources. Family-level attributes emphasize low-power operation, high functionality and system integration capabilities useful for portable and high-volume applications.

Key Features

  • Logic Capacity  70,208 logic elements provide substantial programmable fabric for mid-range designs and complex control logic.
  • Embedded Memory  Approximately 3.07 Mbits of on-chip RAM to support buffering, FIFO, and lookup table needs without external memory.
  • I/O Count & Flexibility  278 user I/Os in a 484-FBGA package enable wide interfacing options for sensors, peripherals, and system buses.
  • Low-Power Family Design  Cyclone III family features TSMC low-power process technology and silicon/software optimizations aimed at minimizing static power for battery- or thermally-constrained designs.
  • Clock Management  Cyclone III family architecture provides dedicated clock resources (including multiple PLLs) for robust clock synthesis and distribution in system designs.
  • Package & Mounting  Surface-mount 484-FBGA (supplier 484-UBGA, 19×19) simplifies PCB routing while delivering high I/O density in a compact footprint.
  • Commercial Grade & Temperature Range  Commercial-grade device rated for 0 °C to 85 °C operation to support standard commercial applications.
  • RoHS Compliant  Environmentally compliant manufacturing meets RoHS requirements.

Typical Applications

  • Portable and Handheld Devices  Low-power family characteristics help extend battery life and enable thermally efficient operation in compact products.
  • Consumer Electronics  High logic and memory integration with abundant I/Os supports custom feature integration and user-interface control in consumer systems.
  • Communications and Networking  Substantial logic resources and on-chip memory enable protocol handling, packet buffering, and interface bridging tasks.
  • Embedded Control and Instrumentation  Flexible I/O and clocking resources support sensor interfacing, timing-critical control loops, and embedded processing tasks.

Unique Advantages

  • High integration reduces BOM  70,208 logic elements and ~3.07 Mbits of embedded memory reduce reliance on external logic and memory components.
  • Designed for low-power operation  Family-level low-power process and power-aware design flow help lower system-level static power and cooling requirements.
  • Rich I/O in a compact package  278 I/Os in a 484-FBGA (19×19) deliver dense connectivity while keeping board area compact.
  • Robust clock management  Multiple PLL resources in the Cyclone III architecture simplify clocking, enable phase/frequency control, and support diverse interface timing needs.
  • Commercial-ready qualification  Rated for 0 °C to 85 °C and RoHS compliant for straightforward integration into commercial product lines.
  • Family-level ecosystem  Cyclone III family documentation and pre-built IP options provide design starting points and integration aids for faster development.

Why Choose EP3CLS70U484C7N?

The EP3CLS70U484C7N combines substantial programmable logic, embedded memory, and a high I/O count in a compact 484-FBGA package, making it well suited for commercial, low-power, and cost-sensitive designs that need mid-range density and strong system integration. Its operation on a 1.15 V–1.25 V supply and RoHS compliance make it practical for modern commercial product development.

Choose this Cyclone III device when you need a balance of logic capacity, on-chip memory, and flexible interfacing backed by family-level features aimed at low-power operation and reliable system clocking. The device is positioned for designers seeking scalable FPGA integration within commercial temperature ranges and established family documentation and IP support.

Request a quote or submit an inquiry to obtain pricing and availability for EP3CLS70U484C7N. Our team can provide lead-time information and support your procurement needs.

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