EP3CLS70U484C7N
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 278 3068928 70208 484-FBGA |
|---|---|
| Quantity | 277 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-UBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-FBGA | Number of I/O | 278 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4388 | Number of Logic Elements/Cells | 70208 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3068928 |
Overview of EP3CLS70U484C7N – Cyclone® III Field Programmable Gate Array (FPGA) IC 278 3068928 70208 484-FBGA
The EP3CLS70U484C7N is a Cyclone III family FPGA from Intel, offering a mid-range programmable logic platform with 70,208 logic elements and approximately 3.07 Mbits of embedded memory. Designed for commercial applications, this surface-mount device provides 278 user I/Os in a 484-FBGA package (484-UBGA, 19×19) and operates from a 1.15 V to 1.25 V core supply across a 0 °C to 85 °C temperature range.
Built on the Cyclone III device family architecture, the device targets cost- and power-sensitive designs that require substantial logic density, on-chip memory, and flexible I/O and clocking resources. Family-level attributes emphasize low-power operation, high functionality and system integration capabilities useful for portable and high-volume applications.
Key Features
- Logic Capacity 70,208 logic elements provide substantial programmable fabric for mid-range designs and complex control logic.
- Embedded Memory Approximately 3.07 Mbits of on-chip RAM to support buffering, FIFO, and lookup table needs without external memory.
- I/O Count & Flexibility 278 user I/Os in a 484-FBGA package enable wide interfacing options for sensors, peripherals, and system buses.
- Low-Power Family Design Cyclone III family features TSMC low-power process technology and silicon/software optimizations aimed at minimizing static power for battery- or thermally-constrained designs.
- Clock Management Cyclone III family architecture provides dedicated clock resources (including multiple PLLs) for robust clock synthesis and distribution in system designs.
- Package & Mounting Surface-mount 484-FBGA (supplier 484-UBGA, 19×19) simplifies PCB routing while delivering high I/O density in a compact footprint.
- Commercial Grade & Temperature Range Commercial-grade device rated for 0 °C to 85 °C operation to support standard commercial applications.
- RoHS Compliant Environmentally compliant manufacturing meets RoHS requirements.
Typical Applications
- Portable and Handheld Devices Low-power family characteristics help extend battery life and enable thermally efficient operation in compact products.
- Consumer Electronics High logic and memory integration with abundant I/Os supports custom feature integration and user-interface control in consumer systems.
- Communications and Networking Substantial logic resources and on-chip memory enable protocol handling, packet buffering, and interface bridging tasks.
- Embedded Control and Instrumentation Flexible I/O and clocking resources support sensor interfacing, timing-critical control loops, and embedded processing tasks.
Unique Advantages
- High integration reduces BOM 70,208 logic elements and ~3.07 Mbits of embedded memory reduce reliance on external logic and memory components.
- Designed for low-power operation Family-level low-power process and power-aware design flow help lower system-level static power and cooling requirements.
- Rich I/O in a compact package 278 I/Os in a 484-FBGA (19×19) deliver dense connectivity while keeping board area compact.
- Robust clock management Multiple PLL resources in the Cyclone III architecture simplify clocking, enable phase/frequency control, and support diverse interface timing needs.
- Commercial-ready qualification Rated for 0 °C to 85 °C and RoHS compliant for straightforward integration into commercial product lines.
- Family-level ecosystem Cyclone III family documentation and pre-built IP options provide design starting points and integration aids for faster development.
Why Choose EP3CLS70U484C7N?
The EP3CLS70U484C7N combines substantial programmable logic, embedded memory, and a high I/O count in a compact 484-FBGA package, making it well suited for commercial, low-power, and cost-sensitive designs that need mid-range density and strong system integration. Its operation on a 1.15 V–1.25 V supply and RoHS compliance make it practical for modern commercial product development.
Choose this Cyclone III device when you need a balance of logic capacity, on-chip memory, and flexible interfacing backed by family-level features aimed at low-power operation and reliable system clocking. The device is positioned for designers seeking scalable FPGA integration within commercial temperature ranges and established family documentation and IP support.
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