EP3CLS70U484C7

IC FPGA 278 I/O 484UBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 278 3068928 70208 484-FBGA

Quantity 120 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-FBGANumber of I/O278Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4388Number of Logic Elements/Cells70208
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3068928

Overview of EP3CLS70U484C7 – Cyclone® III FPGA, 484-FBGA

The EP3CLS70U484C7 is a Cyclone® III field-programmable gate array (FPGA) offered in a 484-FBGA package. It delivers a balance of high functionality and low-power operation targeted at high-volume, cost-sensitive, and low-power applications.

Built for system integration, this device combines a large logic capacity with on-chip embedded memory and a high I/O count to support a wide range of user interfaces and clocking needs while operating within a commercial temperature range and a low core-voltage window.

Key Features

  • Logic Capacity — 70,208 logic elements to implement complex combinational and sequential logic.
  • On‑chip Memory — Approximately 3.07 Mbits of embedded RAM for FIFOs, buffering, and packet/stream processing tasks.
  • High I/O Count — 278 user I/O pins to support diverse external interfaces and parallel connectivity.
  • Low‑Voltage Core — Core supply range from 1.15 V to 1.25 V designed for low-power operation.
  • Clock Management — Family-level support includes up to four PLLs per device with five outputs per PLL for flexible clock synthesis and distribution (as described for the Cyclone III family).
  • Flexible I/O Standards — Family documentation lists support for common I/O standards (LVTTL, LVCMOS and multiple high-speed and differential standards) and adjustable I/O slew rates to help with signal integrity.
  • Package & Mounting — 484-FBGA (supplier package: 484-UBGA, 19×19) in a surface-mount form factor for compact board-level integration.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation suitable for commercial applications.
  • RoHS Compliant — Meets RoHS environmental compliance requirements.

Typical Applications

  • Portable and battery-powered devices — Low-power Cyclone III family characteristics help extend battery life and reduce cooling needs.
  • Communications and networking — Large logic capacity, abundant I/Os, and on-chip memory enable packet processing, bridging, and interface adaptation.
  • Video and imaging — Embedded RAM and extensive logic resources support buffering, streaming, and data-path acceleration tasks.
  • Instrumentation and test equipment — Flexible I/O standards and PLL-based clocking facilitate precise timing and multi-protocol interfacing.

Unique Advantages

  • Significant logic resources — 70,208 logic elements provide headroom for medium-to-large FPGA designs without moving to higher-cost families.
  • Compact board footprint — 484-FBGA (484-UBGA, 19×19) package offers high pin density for space-constrained PCBs.
  • Designed for low power — Family-level low-power process and optimizations reduce static power, supporting thermally constrained designs.
  • Broad system integration — High memory-to-logic ratio and multi-PLL clocking options simplify implementation of integrated subsystems.
  • Flexible interfacing — High I/O count and support for multiple I/O standards ease connectivity to diverse peripherals and external logic.
  • Procurement-friendly compliance — Surface-mount, RoHS-compliant package suitable for modern manufacturing and assembly flows.

Why Choose EP3CLS70U484C7?

EP3CLS70U484C7 positions itself as a practical Cyclone III family FPGA option for designers who need a large logic fabric, several megabits of embedded memory, and a high number of I/Os in a commercially rated, low-voltage device. Its combination of low-power family characteristics, flexible clocking, and compact 484-FBGA package make it appropriate for cost-sensitive, high-volume designs that require meaningful on-chip integration without exceeding commercial operating conditions.

This part suits engineering teams focused on rapid integration, predictable power/thermal envelopes, and broad I/O connectivity—delivering long-term value through a well-documented device family and available ecosystem IP.

Request a quote or submit a purchase inquiry to obtain pricing and lead-time information for EP3CLS70U484C7.

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