EP3CLS70F780C8

The EP3CLS70F780C8 is a Cyclone III family field-programmable gate array (FPGA) in a 780-ball BGA package designed for mid-range, low-power digital logic integration. As a member of the Cyclone III family, it targets high-functionality, cost- and power-sensitive designs that require substantial on-chip logic, memory, and I/O resources.

Key value comes from a combination of 70,208 logic elements, approximately 3.07 Mbits of embedded memory, a high I/O count, and low-power process characteristics—making it suitable for applications that need dense logic and flexible interfacing in a commercial-temperature, surface-mount form factor.

Key Features

• Core Logic — 70,208 logic elements to implement mid-range digital designs and custom accelerators.
• Embedded Memory — Approximately 3.07 Mbits of on-chip RAM for data buffering, look-up tables, and state storage.
• I/O Capacity — 413 user I/O pins for dense peripheral and interface connectivity across a wide range of system signals.
• Clock Management — Family-level support includes multiple phase-locked loops (PLLs) for robust clock synthesis and distribution.
• Low-Voltage Core — Core supply range of 1.15 V to 1.25 V to support low-power operation and reduced thermal load.
• Package & Mounting — 780-ball FBGA (29 × 29) package, surface-mount compatible for modern PCB assembly flows.
• Operating Range — Commercial grade operation from 0 °C to 85 °C for standard consumer and industrial-adjacent applications.
• Environmental Compliance — RoHS compliant to meet current material and assembly requirements.

Typical Applications

• Low-power portable and handheld products — Leverages Cyclone III low-power characteristics and 1.15–1.25 V core operation to help extend battery life and reduce cooling needs.
• High-density I/O interfaces — 413 I/Os enable aggregation and protocol bridging for communications, display, or sensor subsystems.
• Embedded processing and custom logic — On-chip memory and logic capacity are well suited for implementing soft processors, accelerators, and control engines.
• System integration and glue logic — Use the device to consolidate multiple discrete functions, reducing BOM complexity in medium-complexity designs.

Unique Advantages

• Substantial logic capacity: 70,208 logic elements provide room for complex state machines, datapaths, and custom IP.
• On-chip memory for real-time buffering: Approximately 3.07 Mbits of embedded RAM supports data caching and local storage without external memory.
• Extensive I/O: 413 user I/Os reduce the need for additional interface chips and simplify PCB routing for multi-sensor or multi-protocol designs.
• Low-voltage operation: Narrow core voltage range (1.15–1.25 V) supports reduced power consumption and easier power-rail design.
• Surface-mount 780-FBGA: Compact 29 × 29 FBGA package enables high-density PCB layouts for space-constrained products.
• RoHS compliant and commercial grade: Meets common environmental requirements and operates across a standard commercial temperature range (0 °C to 85 °C).

Why Choose EP3CLS70F780C8?

The EP3CLS70F780C8 offers a balanced combination of logic density, embedded memory, and a high I/O count within a low-power Cyclone III family architecture. It is positioned for designers who need significant on-chip resources and flexible interfacing in a compact surface-mount package while maintaining commercial temperature operation and RoHS compliance.

This device is appropriate for teams building cost-sensitive, power-conscious systems that require scalable logic capacity and integrated memory—enabling reduced BOM complexity and consolidated system functions with proven Cyclone III family capabilities.

Request a quote or submit an RFQ to start procurement for EP3CLS70F780C8 and discuss availability and pricing for your design requirements.