EP3CLS70F484I7

The EP3CLS70F484I7 is a Cyclone® III family FPGA delivering a balance of logic density, embedded memory and I/O capacity for industrial applications. As a member of the Cyclone III device family, it targets high-volume, low-power, cost-sensitive designs where integration, I/O flexibility and robust clock management are important.

Specifically designed for surface-mount PCB assembly in a 484-BGA (484-FBGA, 23×23) package, this industrial-grade device operates across a wide temperature range and complies with RoHS environmental requirements.

Key Features

• Logic Capacity  Provides 70,208 logic elements to implement complex combinational and sequential logic functions.
• Embedded Memory  Approximately 3.07 Mbits of on-chip RAM (3,068,928 total RAM bits) for datapath buffering, FIFOs and on-chip storage.
• I/O Count & Flexibility  278 user I/Os to support dense external interfacing and multiple parallel buses.
• Low-Voltage Core  Core supply range of 1.15 V to 1.25 V for modern low-power designs.
• Industrial Temperature Range  Rated for −40°C to 100°C operation for demanding environments.
• Package & Mounting  484-BGA (supplier package 484-FBGA, 23×23) in a surface-mount form factor for compact PCB layouts.
• Family-Level Low Power  Cyclone III family optimizations and TSMC low-power process technology reduce static power consumption for battery-aware and thermally constrained systems.
• Clock Management  Cyclone III family devices provide multiple PLLs for robust clock synthesis and distribution (family-level feature).
• I/O Standards & Signal Integrity  Family-level support for a wide set of I/O standards and features such as adjustable slew rates and on-chip termination calibration to help meet signal-integrity requirements.
• RoHS Compliant  Meets RoHS environmental requirements.

Typical Applications

• Industrial Control  Use the device for motor control, PLC logic and factory automation where industrial temperature rating and high I/O count are required.
• Communications & Networking  Implement interface bridging, packet buffering and protocol logic that benefit from large I/O counts and embedded memory.
• Embedded Systems  On-chip RAM and abundant logic elements enable custom peripherals, data-path acceleration and glue logic in embedded platforms.
• High-Density I/O Interfaces  Ideal for systems that require many parallel or differential I/Os and configurable signaling standards supported at the family level.

Unique Advantages

• Highly Scalable Logic & Memory:  70,208 logic elements combined with approximately 3.07 Mbits of embedded memory provide headroom for complex functions without external RAM.
• High I/O Integration:  278 user I/Os reduce the need for external interface components and simplify board-level routing.
• Optimized for Low Power:  Cyclone III family design and process choices lower static power consumption for energy-sensitive designs.
• Robust Clocking Options:  Family-level multiple PLL support enables flexible clock synthesis and low-jitter distribution for timing-critical logic.
• Industrial Reliability:  Rated for −40°C to 100°C operation, suitable for thermally and environmentally demanding applications.
• Compact, Surface-Mount Package:  484-FBGA (23×23) package supports high-density PCB implementations while maintaining signal routing efficiency.

Why Choose EP3CLS70F484I7?

The EP3CLS70F484I7 brings Cyclone III family capabilities—substantial logic density, meaningful on-chip memory and a high I/O count—into an industrial-grade, surface-mount 484-BGA package. Its low-voltage core range and family-level low-power optimizations make it suitable for designs that must balance performance with thermal and power constraints.

This device is well suited to engineers building embedded control, networking interfaces and I/O-intensive systems that require a compact, RoHS-compliant FPGA with robust clocking and industrial temperature support.

Request a quote or submit a purchase inquiry to evaluate EP3CLS70F484I7 for your next design project.