EP3CLS70F484C8N

The EP3CLS70F484C8N is an Intel Cyclone® III FPGA device engineered for high-functionality, low-power, cost-sensitive designs. As a member of the Cyclone III family, it combines a substantial logic resource set with embedded memory and a high I/O count, making it suitable for a range of commercial applications.

Targeted at high-volume, low-power applications, this surface-mount 484-FBGA (23×23) packaged device delivers 70,208 logic elements, approximately 3.07 Mbits of embedded memory, and 278 user I/Os while operating from a 1.15 V to 1.25 V core supply within a 0 °C to 85 °C commercial temperature range.

Key Features

• Logic Capacity  70,208 logic elements provide a large fabric for implementing complex digital functions and custom logic.
• Embedded Memory  Approximately 3.07 Mbits of on-chip RAM to support buffering, packet storage, and state machines without external memory.
• I/O Resources  278 user I/Os accommodate wide parallel interfaces, multiple buses, and diverse peripheral connections.
• Low-Voltage Core  Core supply range of 1.15 V to 1.25 V supports low-power operation and integration with modern power rails.
• Package and Mounting  484-FBGA (23×23) surface-mount package (484-BGA case) for compact board-level integration and high pin density.
• Commercial Grade  Rated for 0 °C to 85 °C operation for standard commercial applications.
• RoHS Compliant  Conforms to RoHS environmental requirements for lead-free assembly.
• Cyclone III Family Capabilities  Family features include low-power TSMC LP process technology, integrated PLLs for clock management, and a high memory-to-logic ratio to support system integration.

Typical Applications

• Embedded Control and Processing  Implement custom control logic, protocol processing, and peripheral bridging where large logic capacity and embedded RAM reduce external components.
• High-Density I/O Interfaces  Use the 278 I/Os to aggregate multiple sensor lanes, parallel buses, or multi-channel interfaces on a single FPGA.
• Low-Power, Volume Products  Suitable for cost-sensitive, high-volume designs that benefit from the Cyclone III family’s low-power silicon and efficient logic-to-memory balance.
• System Integration  Consolidate glue logic, timing-critical datapaths, and buffering functions to reduce overall BOM and PCB complexity.

Unique Advantages

• High Logic Density: 70,208 logic elements enable complex custom logic and parallel datapaths without external ASIC development.
• On-Chip Memory: Approximately 3.07 Mbits of embedded RAM supports local data storage for FIFOs, frame buffers, and state machines, reducing external memory dependence.
• Extensive I/O Count: 278 user I/Os allow direct interfacing to a broad set of peripherals and multi-lane interfaces, simplifying board design.
• Compact, High-Pin Package: 484-FBGA (23×23) offers a balance of high pin density in a compact footprint for space-constrained PCBs.
• Low-Voltage Operation: 1.15 V–1.25 V core supply supports modern power architectures and contributes to reduced overall system power.
• RoHS Compliance: Lead-free, RoHS-compliant construction supports regulatory requirements for consumer and commercial products.

Why Choose EP3CLS70F484C8N?

The EP3CLS70F484C8N positions itself as a capable Cyclone III FPGA choice for commercial designs that demand significant logic resources, substantial on-chip memory, and a high I/O pin count in a compact BGA package. Its low-voltage operation and family-level low-power characteristics make it appropriate for cost-sensitive, high-volume products that require efficient power use and system consolidation.

Engineers and program managers targeting reduced BOM, tighter board integration, and flexible programmable logic can leverage this device’s blend of capacity and I/O to accelerate development while relying on the Cyclone III family ecosystem for design support.

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