EP3CLS70F484I7N

The EP3CLS70F484I7N is a Cyclone® III field-programmable gate array (FPGA) from Intel, offered in a 484-BGA (484-FBGA, 23×23) package for surface-mount assembly. As a member of the Cyclone III device family, it is designed to deliver high functionality with low power consumption for high-volume, cost-sensitive applications.

This device combines a high logic element count with several megabits of embedded memory and a large I/O complement, making it suitable for designs that require dense logic integration, flexible I/O, and robust clock management within an industrial temperature range.

Key Features

• Logic Capacity – 70,208 logic elements provide substantial programmable logic resources for medium-to-high density designs.
• Embedded Memory – Approximately 3.07 Mbits of on-chip RAM to support buffering, FIFOs, and local storage.
• I/O Density – 278 user I/Os to support multiple parallel interfaces and high pin-count peripherals.
• Power Supply – Core voltage operation from 1.15 V to 1.25 V for compatibility with Cyclone III device family power profiles.
• Clock Management – Benefits from Cyclone III family clock resources, including multiple phase-locked loops (PLLs) for robust clock synthesis and distribution.
• I/O Standards & Termination – As part of the Cyclone III family, supports a wide range of I/O standards and on-chip termination calibration to address signal-integrity needs across process, voltage, and temperature.
• Package & Mounting – 484-BGA (484-FBGA, 23×23) package in a surface-mount form factor for compact PCB integration.
• Operating Range & Grade – Industrial-grade device with specified operation from −40 °C to 100 °C.
• Compliance – RoHS-compliant.

Typical Applications

• Portable and Handheld Devices – Low-power architecture from the Cyclone III family supports battery-operated designs where power efficiency matters.
• High‑I/O Embedded Systems – 278 I/Os enable multi-interface controllers, bridging, and protocol conversion in I/O-constrained systems.
• Industrial Control and Automation – Industrial temperature rating and dense logic make the device suitable for motor control, sensor aggregation, and machine I/O tasks.
• Remote Upgradeable Systems – Family-level support for remote system upgrade capabilities allows field updates without external controllers.

Unique Advantages

• High Logic Density: 70,208 logic elements provide headroom for complex state machines, DSP preprocessing, or glue logic without external ASICs.
• Integrated On‑Chip Memory: Approximately 3.07 Mbits of embedded RAM reduces external memory requirements and simplifies board-level design.
• Extensive I/O Count: 278 user I/Os support multiple parallel interfaces, reducing the need for additional I/O expanders.
• Industrial Temperature Capability: Specified for −40 °C to 100 °C operation to meet demanding environmental requirements.
• Compact BGA Package: 484-FBGA (23×23) enables high pin density in a compact footprint for space-constrained PCBs.
• RoHS Compliance: Conforms to RoHS requirements to support environmental and regulatory needs.

Why Choose EP3CLS70F484I7N?

The EP3CLS70F484I7N places a substantial pool of programmable logic, embedded memory, and I/O resources into a compact 484-BGA package while operating across an industrial temperature range. It is well suited to designers who need to consolidate functions, reduce BOM complexity, and deliver low-power solutions for high-volume or thermally constrained products.

As part of the Cyclone III device family, this FPGA benefits from family-level features such as power-aware optimizations, extensive I/O standard support, and flexible clock management—providing a pragmatic balance of integration, efficiency, and design flexibility for embedded and industrial applications.

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