EP3CLS70F780C7N

The EP3CLS70F780C7N is an Intel Cyclone® III Field Programmable Gate Array (FPGA) offered in a 780-ball BGA package. It combines a mid-range logic fabric with on-chip embedded memory and a high I/O count to address cost-sensitive, low-power system designs.

Targeted at high-volume and power-aware applications, this Cyclone III-class device supports versatile I/O, integrated clock management, and embedded memory to simplify system integration and accelerate time-to-market.

Key Features

• Logic Capacity  70,208 logic elements providing substantial combinational and sequential resources for mid-range FPGA designs.
• Embedded Memory  Approximately 3.07 Mbits of on-chip RAM to support buffering, FIFOs, and small local data stores without external memory.
• I/O Resources  413 user I/O pins to accommodate diverse interface requirements and parallel connectivity.
• Clock Management  Cyclone III family devices include advanced PLL features for multi-clock synthesis, phase control, and dynamic reconfiguration to manage system timing.
• Low-Voltage Core  Core operates from 1.15 V to 1.25 V, enabling compatibility with low-voltage system architectures and power-optimized designs.
• Package & Mounting  780-FBGA surface-mount package (29 × 29 mm) for compact PCB implementation and automated assembly.
• Operating Range & Grade  Commercial-grade device rated for 0 °C to 85 °C ambient operation.
• Environmental Compliance  RoHS-compliant for regulatory and manufacturing considerations.

Typical Applications

• Portable and Handheld Devices  Low-power operation and integrated resources make this FPGA suitable for battery-conscious, compact systems.
• Consumer Electronics  Use for video processing blocks, display controllers, and feature-rich consumer interfaces where moderate logic and memory are required.
• Communications & Networking  High I/O count and flexible clocking support interface bridging, protocol adaptation, and packet handling in mid-range network equipment.
• High-volume, Cost-Sensitive Designs  Cyclone III family characteristics are aligned with applications that demand a balance of performance, integration, and low BOM cost.

Unique Advantages

• High Logic Density: 70,208 logic elements provide the capacity to implement complex control, signal processing, and glue-logic functions on a single device.
• Substantial On-Chip Memory: Approximately 3.07 Mbits of embedded RAM reduce dependence on external memory, lowering BOM and improving system latency.
• Generous I/O Count: 413 user I/Os enable multiple parallel interfaces and flexible board-level partitioning without added chips.
• Low-Voltage Core: 1.15 V to 1.25 V supply supports energy-efficient system design and compatibility with modern low-voltage rails.
• Compact BGA Package: 780-FBGA (29 × 29 mm) delivers a high-pin-count solution in a space-efficient surface-mount footprint.
• Design Ecosystem Alignment: As a Cyclone III family device, it benefits from the family’s architecture and tool support for development and deployment workflows.

Why Choose EP3CLS70F780C7N?

The EP3CLS70F780C7N positions itself as a balanced, mid-density FPGA option that brings together a large logic element count, meaningful embedded memory, and a high I/O complement in a compact 780-BGA package. Its low-voltage core and Cyclone III family features make it well suited for designers targeting cost- and power-sensitive products that still require solid integration and timing flexibility.

This device is ideal for engineering teams building portable electronics, consumer systems, and mid-range communications equipment who need a reliable FPGA platform with on-chip resources to reduce component count and accelerate development.

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