EP3CLS70F484C7

The EP3CLS70F484C7 is a Cyclone® III field programmable gate array (FPGA) device designed for low-power, cost-sensitive applications. It combines a large fabric of 70,208 logic elements with on-chip embedded memory and a high I/O count to support complex system integration in commercial-grade designs.

Built on the Cyclone III device family architecture, this device targets applications that require high logic density, flexible I/O connectivity, and efficient power utilization while operating within a commercial temperature range.

Key Features

• Logic Fabric  70,208 logic elements provide substantial programmable logic resources for mid-range FPGA designs.
• Embedded Memory  Approximately 3.07 Mbits of on-chip RAM (3,068,928 total RAM bits) to support buffering, data storage, and embedded functions without external memory.
• I/O Capacity  278 general-purpose I/O pins accommodate multiple interfaces and signal domains for rich system connectivity.
• Clock Management  Cyclone III family features up to four phase-locked loops (PLLs) per device with multiple outputs, enabling robust clock synthesis and management for internal logic and I/O interfaces.
• Low-Power Operation  Designed as part of the low-power Cyclone III family and supported by a 1.15 V to 1.25 V core supply range to help meet power budgets in portable and thermally constrained designs.
• Package & Mounting  484-ball FBGA package (23 × 23 mm footprint) in a surface-mount form factor for compact PCB integration.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation, suitable for standard commercial applications.
• Standards & I/O Options  Cyclone III family supports a wide range of I/O standards (examples include LVTTL, LVCMOS, SSTL, HSTL, PCI, LVDS and others), enabling flexible interface choices for system designers.
• RoHS Compliance  Device is RoHS compliant, supporting regulatory requirements for hazardous substance restrictions.

Typical Applications

• Embedded Systems  Use the FPGA’s 70,208 logic elements and embedded memory to implement custom processing, peripheral control, and glue-logic in compact embedded platforms.
• Data Acquisition & Signal Conditioning  High I/O count and on-chip memory enable buffering and multi-channel sensor interfacing for data collection and preprocessing.
• Communications & Networking  Flexible I/O standards and clock-management resources support protocol bridging, packet processing, and interface adaptation.
• Consumer & Industrial Electronics  Low-power characteristics and commercial-grade temperature range suit a broad set of consumer and light industrial control, display, and user-interface functions.

Unique Advantages

• High Logic Density: 70,208 logic elements provide the capacity to implement sizeable custom logic and state machines without external ASICs.
• Integrated Memory Resources: Approximately 3.07 Mbits of embedded RAM reduces dependence on external memory components and simplifies board design.
• Extensive I/O Flexibility: 278 I/Os and support for numerous I/O standards allow the device to interface with a wide variety of peripherals and signaling technologies.
• On-chip Clocking: Multiple PLLs and dynamic reconfiguration capabilities (as provided by the Cyclone III family) enable sophisticated clock architectures and flexible timing management.
• Compact, Surface-Mount Package: The 484-FBGA (23 × 23) package delivers a space-efficient solution for PCB-constrained designs.
• Regulatory Readiness: RoHS compliance supports product development for markets with hazardous-substance restrictions.

Why Choose EP3CLS70F484C7?

The EP3CLS70F484C7 combines a substantial logic fabric, multi-megabit on-chip RAM, and a high I/O count in a compact 484-BGA package, making it well suited for commercial applications that demand integration and flexible interfacing. Its placement in the Cyclone III family brings low-power design considerations and clock-management features that help designers meet power and timing requirements.

This device is a practical choice for engineers building mid-range FPGA-based solutions that require a balance of logic capacity, memory, and I/O without exceeding commercial temperature limits. Its feature set supports scalable designs, streamlined board layouts, and fewer external components, contributing to reduced BOM complexity.

Request a quote or submit an inquiry to obtain pricing and availability for EP3CLS70F484C7 and to discuss how this Cyclone III FPGA can fit into your next design.