EP3CLS200F780C7

The EP3CLS200F780C7 is a Cyclone® III family FPGA supplied in a 780-ball FBGA (29×29) surface-mount package. It provides a high-density, low-power programmable logic fabric suitable for cost- and power-sensitive commercial applications that require substantial on-chip logic, memory and I/O resources.

Built for applications that need large logic capacity and embedded memory while operating within a commercial temperature range, this device delivers a balance of integration and efficiency for system and board designers.

Key Features

• High Logic Capacity 198,464 logic elements for large-scale logic implementation and complex digital designs.
• Embedded Memory Approximately 8 Mbits of on-chip RAM (8,211,456 bits) to support data buffering, state storage and local memory needs without external SDRAM.
• Rich I/O Count 413 user I/O pins to support diverse interfaces and peripherals on a single device.
• Low-Power Family Characteristics Cyclone III family attributes include low-power process optimizations and static power figures targeted under approximately ¼ watt for family devices.
• Clock Management Cyclone III family devices provide multi-PLL clock management capabilities to support complex clocking and synthesis needs.
• Package and Mounting 780-FBGA (29×29) surface-mount package for dense PCB implementations and reliable solder mounting.
• Supply Voltage Core voltage range from 1.15 V to 1.25 V to match system power rails and regulator designs.
• Commercial Temperature Grade Designed for 0 °C to 85 °C operating temperature suitable for commercial applications.
• RoHS Compliant Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

• Portable and Handheld Devices Leverages the Cyclone III family’s low-power characteristics to extend battery life in portable electronics where power budget is limited.
• High-Volume, Cost-Sensitive Products Targets designs that require high integration at a competitive BOM cost, combining logic, memory and I/O on a single chip.
• I/O-Intensive Systems Provides ample user I/Os (413) for systems that must interface with multiple peripherals, sensors or external devices without additional interface chips.
• Embedded Processing and Control Large logic and memory resources support soft-core processors, complex control logic and state machines in embedded systems.

Unique Advantages

• Extensive On-Chip Resources: 198,464 logic elements and approximately 8 Mbits of embedded memory reduce reliance on external components and simplify board-level design.
• High I/O Density: 413 I/Os allow direct connection of multiple peripherals and interfaces, minimizing the need for external multiplexing or expanders.
• Low-Power Design: Cyclone III family optimizations target low static power consumption, helping designs meet strict power budgets.
• Flexible Clocking: Family-level clock management features enable robust timing architectures for multi-domain systems.
• Commercial Temperature and RoHS Compliance: Rated 0 °C to 85 °C and RoHS compliant for standard commercial deployments and lead-free assembly processes.
• Compact, Surface-Mount Package: 780-FBGA (29×29) provides a compact footprint for dense PCB layouts while supporting reliable surface-mount manufacturing.

Why Choose EP3CLS200F780C7?

The EP3CLS200F780C7 combines large-scale programmable logic, substantial embedded memory and a high I/O count in a compact 780-FBGA package. It is positioned for commercial designs that demand high integration and efficient power use while maintaining flexibility for complex logic, embedded processing and multi-interface systems.

For designers targeting scalable, cost-sensitive products, this Cyclone III device offers a strong platform—backed by the family’s low-power design choices and on-chip system features—to simplify BOM, reduce board complexity and accelerate time to market.

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