EP3CLS200F484C8ES

The EP3CLS200F484C8ES is a Cyclone® III FPGA from Intel, offered in a 484-ball BGA package for surface-mount assembly. It delivers a high density of programmable logic and on-chip memory aimed at high-volume, low-power, and cost-sensitive designs.

Designed around the Cyclone III device family architecture, this FPGA targets applications requiring significant logic capacity, substantial embedded RAM, and flexible I/O while operating within a commercial temperature range.

Key Features

• High-density logic — 198,464 logic elements provide substantial programmable logic capacity for complex designs.
• Embedded memory — Approximately 7.83 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage without external memory.
• I/O resources — 210 user I/O pins to support multiple interfaces and peripheral connections on dense PCBs.
• Low-voltage core — Core voltage supply range of 1.15 V to 1.25 V consistent with low-power FPGA operation.
• Low-power family characteristics — Cyclone III family employs a low-power TSMC process and silicon optimizations to minimize power consumption for battery-powered and thermally constrained systems.
• Package and mounting — 484-ball FBGA (23×23) surface-mount package suitable for compact, high-density board layouts.
• Commercial temperature range — Rated for 0 °C to 85 °C operation for standard commercial applications.
• RoHS compliant — Meets RoHS requirements for lead-free assembly and global compliance needs.

Typical Applications

• Portable and handheld devices — Low-power characteristics help extend battery life in compact systems.
• Consumer electronics — High logic and memory density support feature-rich user interfaces and multimedia processing.
• Embedded systems and appliances — Ample I/O and on-chip RAM enable integration of control, communication, and interface functions on a single chip.
• High-volume, cost-sensitive products — Cyclone III family design focuses on minimizing cost and power for mass-produced devices.

Unique Advantages

• Substantial programmable capacity: 198,464 logic elements allow consolidation of complex functions that reduce external component count.
• Significant on-chip memory: Approximately 7.83 Mbits of embedded RAM enables local buffering and data processing without immediate reliance on external memory.
• Flexible I/O count: 210 available I/Os provide design flexibility for multiple interfaces and peripherals.
• Low-power architecture: Built on a low-power process and family-level optimizations to help meet strict power budgets in portable designs.
• Compact BGA package: 484-FBGA (23×23) supports dense PCB layouts while maintaining manufacturability for surface-mount assembly.
• Commercial temperature and RoHS compliance: Suitable for a wide range of standard commercial applications with lead-free assembly support.

Why Choose EP3CLS200F484C8ES?

The EP3CLS200F484C8ES positions itself as a high-density, low-power Cyclone III FPGA option for designers who need large programmable logic capacity and substantial on-chip memory in a compact BGA package. Its combination of nearly 200k logic elements, approximately 7.83 Mbits of embedded RAM, and 210 I/Os supports integrated system designs where consolidation and power efficiency matter.

This device is well-suited to engineering teams developing high-volume, cost-sensitive products and embedded systems that benefit from the Cyclone III family’s low-power process and integration-focused architecture, backed by Intel’s device ecosystem and documentation.

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