EP3CLS200F484C8

The EP3CLS200F484C8 is an Intel Cyclone® III FPGA in a 484-ball BGA package, optimized for low-power, high-functionality designs. This commercial-grade device combines high logic density and substantial embedded memory to serve cost-sensitive, high-volume applications requiring flexible I/O and on-chip system integration.

Built on the Cyclone III device family architecture, the device is suitable for handheld and portable systems, consumer and embedded applications, and designs that require significant programmable logic and on-chip RAM while operating within a standard commercial temperature range.

Key Features

• High-density logic — 198,464 logic elements provide substantial programmable resources for complex FPGA designs.
• Embedded memory — 8,211,456 total RAM bits (approximately 7.8 Mbits) for on-chip buffering, state storage, and data processing.
• I/O and packaging — 210 user I/Os in a 484-FBGA (23×23) surface-mount package for dense board-level integration and flexible interfacing.
• Low-voltage power — Core voltage supply specified between 1.15 V and 1.25 V to support low-power operation.
• Commercial temperature grade — Rated for 0 °C to 85 °C operation, suitable for standard commercial environments.
• Low-power Cyclone III architecture — Family-level low-power optimizations and TSMC low-power process technology for reduced static power consumption.
• Clock management — Cyclone III family includes on-chip PLLs (four PLLs per device, five outputs per PLL) for robust clock synthesis and management.
• System integration features — Family features include high memory-to-logic and multiplier-to-logic ratios, and availability of the Nios II embedded processor for embedded processing solutions.
• RoHS compliant — Device meets RoHS environmental requirements.

Typical Applications

• Portable and handheld devices — Low-power operation and high on-chip RAM make the device suitable for battery-powered systems and handheld equipment.
• Consumer and high-volume electronics — High logic density and cost-sensitive Cyclone III architecture suit mass-produced consumer products requiring programmable logic.
• Embedded control and signal processing — Large logic array and embedded memory support control logic, protocol handling, and local data buffering.
• I/O-constrained systems — 210 user I/Os and flexible package options enable dense interfacing in applications where board-level I/O is a limiting factor.

Unique Advantages

• Highly integrated logic and memory: Nearly 200k logic elements paired with approximately 7.8 Mbits of embedded RAM reduces the need for external components and simplifies board design.
• Low-voltage, low-power operation: 1.15–1.25 V core supply and Cyclone III low-power technology help minimize power consumption in thermally constrained or battery-operated systems.
• Robust clocking infrastructure: Family-level PLL resources enable flexible clock synthesis and distribution without consuming extensive logic resources.
• Compact, board-ready package: 484-FBGA (23×23) surface-mount package supports high-density PCB layouts while providing ample I/O count.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation for standard commercial deployments.
• Eco-compliant: RoHS compliance supports environmentally conscious product development and regulatory requirements.

Why Choose EP3CLS200F484C8?

The EP3CLS200F484C8 delivers a balance of high logic capacity, substantial on-chip memory, and low-power architecture suitable for commercial embedded and consumer applications. Its Cyclone III family features—such as efficient power characteristics, on-chip clock management, and a high memory-to-logic ratio—enable compact, integrated designs that reduce BOM complexity and support scalable development.

This part is ideal for designers who need a large, low-power FPGA in a compact 484-FBGA package for applications where I/O density, embedded memory, and cost efficiency are primary concerns. The device’s commercial temperature rating and RoHS compliance make it a practical choice for mainstream product lines supported by established Cyclone III device family infrastructure.

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