EP3CLS200F484C7N

IC FPGA 210 I/O 484FBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 210 8211456 198464 484-BGA

Quantity 1,061 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O210Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs12404Number of Logic Elements/Cells198464
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits8211456

Overview of EP3CLS200F484C7N – Cyclone® III Field Programmable Gate Array (FPGA) IC, 198,464 logic elements, ~8.21 Mbits RAM, 210 I/Os, 484-BGA

The EP3CLS200F484C7N is an Intel Cyclone® III family FPGA offering high logic density and substantial on-chip memory in a compact 484-ball BGA package. Built on the Cyclone III device architecture, this part targets high-volume, low-power, cost-sensitive commercial applications that require extensive programmable logic, abundant embedded memory and a generous I/O complement.

With 198,464 logic elements and approximately 8.21 Mbits of embedded RAM, the device is suited for designs that need significant logic and data buffering on-chip while operating within a commercial temperature range and a 1.15–1.25 V core supply window.

Key Features

  • Logic Capacity  Approximately 198,464 logic elements provide a large, flexible fabric for complex combinational and sequential logic implementations.
  • Embedded Memory  Approximately 8.21 Mbits of on-chip RAM (8,211,456 bits) for frame buffers, FIFOs, lookup tables and soft-state storage without relying on external memory.
  • I/O Count  210 user I/Os offering ample external connectivity for high-pin-count interfaces and multi-channel designs.
  • Low-Power Family Architecture  Cyclone III device family is optimized for low power via TSMC low-power process technology and a power-aware design flow to help meet strict energy budgets.
  • Clock Management  Family-level clock resources include four phase-locked loops (PLLs) per device with five outputs per PLL for flexible clock synthesis and distribution.
  • Supply Voltage  Core voltage range specified at 1.15 V to 1.25 V for precise power delivery and compatibility with family power domains.
  • Package & Mounting  484-ball FBGA (23 × 23) in a surface-mount BGA format for compact board integration and high I/O density.
  • Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C operation.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • High-volume consumer systems  On-chip logic and memory enable feature-rich consumer products where cost and power are constrained.
  • Portable and battery-powered devices  Low-power family architecture helps extend battery life for handheld products requiring significant programmable logic.
  • Communications and networking  Large logic capacity and abundant I/Os support packet processing, protocol bridging and multi-channel interface implementations.
  • Industrial automation and instrumentation (commercial deployments)  Use for sensor aggregation, user-interface control and deterministic logic tasks within commercial-temperature systems.

Unique Advantages

  • High-density programmable fabric: 198,464 logic elements deliver the headroom to integrate complex state machines, datapaths and control logic on a single device.
  • Significant on-chip memory: Approximately 8.21 Mbits of embedded RAM reduce external memory dependency and simplify board-level BOM and layout.
  • Flexible I/O and package: 210 I/Os in a 484-FBGA (23×23) footprint provide a balance of connectivity and compact PCB real estate.
  • Family-level low-power design: Built on TSMC low-power process technology and supported by power-aware design flows to help your end product meet power targets.
  • Robust clock resources: Multiple PLLs and multi-output clocking options simplify clock domain creation and high-speed interface timing.
  • Commercial-temperature reliability: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial deployments.

Why Choose EP3CLS200F484C7N?

The EP3CLS200F484C7N positions itself as a high-capacity, low-power Cyclone III FPGA option for designers needing substantial on-chip logic and memory within a commercial-temperature device and compact BGA package. It combines family-level low-power optimizations and clock-management resources with a large I/O complement to address demanding system-level integration without excessive external components.

Supported by Cyclone III family resources such as clocking primitives and pre-built IP available for the family, this device suits teams building scalable, cost-sensitive commercial products that benefit from a mature FPGA ecosystem and well-defined design flows.

Request a quote or submit a purchase inquiry to receive pricing and availability for EP3CLS200F484C7N. Our team can help evaluate fit for your design and supply immediate ordering information.

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