EP3CLS150F780C7N

The EP3CLS150F780C7N is a Cyclone III family FPGA delivering a high-density, low-power programmable logic solution. It combines 150,848 logic elements with approximately 6.14 Mbits of embedded memory and 413 user I/Os in a 780-ball FBGA package, making it suitable for complex, space-constrained, commercial-grade applications.

Built on the Cyclone III device family architecture, this device targets cost- and power-sensitive designs that require significant logic capacity, on-chip RAM, and flexible I/O counts for embedded control, communications, and system integration tasks.

Key Features

• Logic Capacity  150,848 logic elements provide substantial programmable logic resources for medium-to-high complexity designs.
• Embedded Memory  Approximately 6.14 Mbits of on-chip RAM to support buffering, packet storage, and stateful processing without external memory in many use cases.
• I/O Resources  413 user I/Os enable broad system interfacing for sensors, peripherals, and high-density board-level connections.
• Power Supply Range  Specified core voltage supply range of 1.15 V to 1.25 V to support the device’s low-power operation characteristics.
• Package and Mounting  780-FBGA (29 × 29 mm) package, surface-mount mounting type—optimized for compact PCB layouts with fine-pitch BGA routing.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial applications.
• RoHS Compliant  Meets RoHS environmental requirements for lead-free manufacturing processes.
• Cyclone III Family Capabilities  As part of the Cyclone III family, devices of this family are designed for low power and high functionality, offering features such as optimized low-power process technology and family-level clock management and memory ratios as described in the Cyclone III device handbook.

Typical Applications

• Embedded Control  Use as a central programmable controller for complex state machines, motor control logic, or custom peripheral management where high logic density and on-chip memory reduce external components.
• Communications and Networking  Packet buffering, protocol bridging, and interface aggregation leveraging on-chip RAM and abundant I/Os for board-level connectivity.
• Video and Imaging Pre-Processing  Implement front-end processing, format conversion, or timing adjustment functions using the device’s logic and memory resources.
• Industrial and Commercial Equipment  Custom I/O handling, sensor aggregation, and local data processing in commercial equipment within the supported 0 °C to 85 °C temperature range.

Unique Advantages

• High Logic Density:  150,848 logic elements enable consolidation of multiple functions into a single device, reducing BOM count and PCB area.
• Substantial On-Chip Memory:  Approximately 6.14 Mbits of embedded RAM supports large buffers and data-intensive tasks without immediate external memory needs.
• Large I/O Count:  413 user I/Os provide flexibility for complex interfacing and multi-channel connectivity on compact designs.
• Compact BGA Package:  780-FBGA (29 × 29) offers a high pin density in a compact footprint suited for space-constrained boards.
• Commercial-Grade Reliability:  Designed for commercial temperature ranges and RoHS compliant manufacturing to meet typical production requirements.
• Family-Level Low-Power Design:  Based on Cyclone III family low-power process and architecture, enabling lower power consumption within the specified core voltage range.

Why Choose EP3CLS150F780C7N?

The EP3CLS150F780C7N positions itself as a high-capacity, low-power Cyclone III FPGA suited to designers who need substantial programmable logic, embedded memory, and extensive I/O in a compact BGA package. Its combination of 150,848 logic elements, approximately 6.14 Mbits of on-chip RAM, and 413 I/Os simplifies system integration and reduces dependency on external components for many commercial applications.

For development teams focused on scalable, cost-conscious designs that require strong logic and memory resources in a commercial-temperature device, this Cyclone III FPGA offers a balance of performance, integration, and manufacturability backed by the Cyclone III device family documentation.

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