EP3CLS150F484C8N

The EP3CLS150F484C8N is a Cyclone® III family FPGA delivering a high-density, low-power programmable fabric for cost-sensitive, high-volume designs. It combines 150,848 logic elements with embedded memory and flexible I/O in a compact 484‑BGA package to address applications where integration, power efficiency, and board-level space savings matter.

As part of the Cyclone III device family, this device targets low-power, high-functionality use cases and benefits from the family’s silicon and process optimizations designed to minimize static power consumption while enabling system integration and clock management.

Key Features

• Logic Capacity  150,848 logic elements provide a large, programmable fabric for complex glue logic, protocol handling, and custom processing.
• Embedded Memory  Approximately 6.14 Mbits of on-chip RAM to support buffering, packet handling, and local data storage without external memory.
• I/O Density  210 user I/Os in a 484‑BGA package to support multi‑lane interfaces and mixed-signal board designs with moderate I/O requirements.
• Power Supply  Operates from a core voltage range of 1.15 V to 1.25 V, aligning with low-power system designs.
• Package  484‑ball FBGA (23 × 23) package for a compact footprint and high pin count in a surface-mount form factor.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation to suit commercial and consumer electronics applications.
• Family-Level Integration  Cyclone III family features include low-power TSMC process optimizations, support for multiple PLLs for robust clock management, and a high memory‑to‑logic ratio.
• RoHS Compliant  Environmentally compliant to RoHS requirements for lead‑free assembly.

Typical Applications

• Portable and Handheld Devices  Low-power operation and compact package make the device suitable for battery‑sensitive products that need programmable logic and local memory.
• Consumer Electronics  High logic and memory density supports multimedia processing, user interface control, and protocol bridging in cost‑sensitive consumer designs.
• Communications and Networking  Embedded RAM and 210 I/Os enable packet buffering, frame processing, and interface aggregation in mid-range networking equipment.
• Embedded Systems  Programmable logic and on-chip resources provide flexible hardware acceleration and custom peripherals for embedded control and data handling.

Unique Advantages

• High Integration: 150,848 logic elements paired with approximately 6.14 Mbits of embedded memory reduce the need for external components and simplify BOM.
• Low-Power Silicon: Built on Cyclone III family low-power process optimizations to help meet strict power budgets in portable and thermally constrained systems.
• Flexible Clocking: Family support for multiple PLLs provides robust clock management and synthesis for complex timing domains and I/O interfaces.
• Compact, High-Pin Package: 484‑BGA (23×23) delivers high pin count in a compact surface-mount footprint for space-constrained PCBs.
• Commercial Temperature Range: Rated 0 °C to 85 °C to align with consumer and commercial product deployment profiles.
• Regulatory Compliance: RoHS compliance supports lead‑free manufacturing processes and environmental requirements.

Why Choose EP3CLS150F484C8N?

The EP3CLS150F484C8N positions itself as a highly integrated, low-power FPGA option within the Cyclone III family for designers seeking substantial logic capacity and embedded memory in a compact footprint. Its combination of 150,848 logic elements, approximately 6.14 Mbits of on-chip RAM, and 210 I/Os makes it a practical choice for high-volume, cost-sensitive commercial applications that require programmable hardware acceleration and flexible I/O.

Choose this device when you need a balance of density, power efficiency, and board-level integration with the proven Cyclone III family architecture and ecosystem support for design and clocking features.

Request a quote or submit an inquiry for pricing and availability to evaluate EP3CLS150F484C8N for your next design.