EP3CLS150F484C8

The EP3CLS150F484C8 is an Intel Cyclone III family field-programmable gate array (FPGA) in a 484-BGA package. It delivers 150,848 logic elements and approximately 6.14 Mbits of embedded memory, targeted at commercial applications that require high integration, configurable logic, and low-power operation.

Built on Cyclone III device architecture, the device is suited for embedded systems, portable electronics, and communications interfaces where on-chip memory, PLL-based clock management, and flexible I/O are important design considerations.

Key Features

• Logic Capacity — 150,848 logic elements with 9,428 logic array blocks (LABs/CLBs) to implement large, complex designs.
• Embedded Memory — Total on-chip RAM of 6,137,856 bits (approximately 6.14 Mbits) for data buffering, FIFOs, and on-chip storage.
• I/O — 210 user I/O pins providing broad interface options for system connectivity.
• Clock Management — Cyclone III family includes four phase-locked loops (PLLs) per device for robust clock synthesis and management.
• Power — Designed with low-power Cyclone III family characteristics; device supply voltage range is 1.15 V to 1.25 V to support low-voltage system designs.
• Package & Mounting — 484-ball FBGA (23×23) surface-mount package (484-BGA) for compact PCB integration.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant, supporting regulatory requirements for lead-free assemblies.
• Family Capabilities — Cyclone III family features such as low-power process technology, power-aware design flow, on-chip memory and multiplier resources, and a broad set of supported I/O standards to address a range of system requirements.

Typical Applications

• Portable and Handheld Devices — Low-power Cyclone III family characteristics and compact 484-BGA package make the device suitable for battery-powered and space-constrained designs.
• Consumer and Multimedia Electronics — Large logic capacity and substantial embedded memory enable user interfaces, signal processing, and bridging functions in consumer products.
• Communications and Networking — Flexible I/O and integrated PLLs support clocking and interface needs for mid-range communications and protocol conversion tasks.
• Embedded Processing — On-chip memory and logic fabric accommodate soft-core processors and custom accelerators for control and data-path functions.

Unique Advantages

• High Logic Density: 150,848 logic elements provide the headroom to implement complex, multi-function designs on a single chip.
• Substantial On-Chip Memory: Approximately 6.14 Mbits of embedded RAM reduces dependence on external memory, simplifying BOM and PCB routing.
• Low-Voltage Operation: 1.15 V to 1.25 V supply range aligns with modern low-voltage system rails to help minimize overall power consumption.
• Compact Surface-Mount Package: 484-FBGA (23×23) balances pin count and board area for dense system integration.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C for applications in consumer and commercial environments.
• RoHS Compliance: Supports lead-free manufacturing processes and environmental requirements.

Why Choose EP3CLS150F484C8?

The EP3CLS150F484C8 combines high logic capacity and substantial embedded memory within a compact 484-BGA package, enabling designers to consolidate functions and reduce external components. Its Cyclone III family heritage provides low-power characteristics, multiple PLLs for clocking flexibility, and a broad I/O complement—features that suit a wide range of commercial embedded and consumer applications.

This device is appropriate for teams needing a commercially graded FPGA with high integration potential, predictable power behavior within the specified voltage range, and the on-chip resources to implement complex logic, buffering, and clocking without excessive external circuitry.

Request a quote or submit an inquiry for pricing and availability to evaluate EP3CLS150F484C8 for your next design.