EP3CLS150F484I7N

The EP3CLS150F484I7N is an Intel Cyclone III family FPGA supplied in a 484-ball FBG A (23×23) package for surface-mount assembly. It delivers 150,848 logic elements, approximately 6.14 Mbits of embedded memory, and 210 user I/Os in an industrial-grade device rated from -40°C to 100°C with a core supply range of 1.15 V to 1.25 V.

As a member of the Cyclone III family, this device targets applications that require a balance of high functionality, low power, and cost-efficient integration, leveraging the family’s low-power process optimizations and system-level features for embedded logic and I/O-intensive designs.

Key Features

• Logic Capacity 150,848 logic elements for implementing large combinational and sequential designs with abundant routing and logic resources.
• Embedded Memory Approximately 6.14 Mbits of on-chip RAM to support buffering, packet processing, and embedded data storage without external memory.
• I/O Resources 210 user I/Os to support wide interfaces, parallel buses, and mixed-signal front-end connectivity.
• Power and Voltage Core voltage supply from 1.15 V to 1.25 V; designed around Cyclone III low-power process technology for reduced static power consumption.
• Clocking and Timing Cyclone III family architecture includes up to four PLLs per device for flexible clock management and synthesis.
• Package and Mounting 484-FBGA (23×23) package, surface-mount construction for high-density PCB designs and reliable thermal performance.
• Industrial Temperature Grade Operating range of -40°C to 100°C suitable for industrial environments and thermally-challenged systems.
• Compliance RoHS compliant.

Typical Applications

• Portable and Handheld Systems Low-power Cyclone III architecture helps extend battery life in portable devices that require programmable logic and on-chip memory.
• Industrial Control Industrial operating temperature rating and abundant I/Os make the device suitable for motor control, PLC interfaces, and sensor aggregation.
• Communications and Networking Large logic capacity and embedded RAM enable packet processing, protocol bridging, and interface aggregation for cost-sensitive network equipment.
• Embedded Processing Cyclone III family support for embedded processor solutions and multiple PLLs enables flexible system integration and local processing tasks.

Unique Advantages

• High FPGA Density: 150,848 logic elements deliver substantial implementation capacity for large logic designs without resorting to multiple devices.
• Significant On-Chip Memory: Approximately 6.14 Mbits of embedded RAM reduces the need for external memory, simplifying BOM and PCB routing.
• Robust I/O Count: 210 I/Os allow direct connection to multiple peripherals and interfaces, minimizing the need for external multiplexing.
• Industrial Robustness: Rated from -40°C to 100°C and supplied in a high-density FBGA package, enabling deployment in demanding industrial environments.
• Low-Power Family Foundation: Based on Cyclone III low-power process technology to help meet tight power budgets and reduce cooling requirements.

Why Choose EP3CLS150F484I7N?

The EP3CLS150F484I7N positions itself as a high-capacity, industrial-grade Cyclone III FPGA for designs that require substantial logic resources, on-chip memory, and a large I/O complement within a compact 484-FBGA footprint. Its combination of scalable logic, embedded RAM, and family-level low-power optimizations makes it appropriate for high-volume, cost-sensitive applications that must also meet industrial temperature and reliability requirements.

Engineers looking to consolidate functionality, reduce external components, and retain flexibility for in-field changes will find the EP3CLS150F484I7N suited to demanding embedded systems, communications equipment, and industrial control solutions.

Request a quote or submit an inquiry to receive pricing and availability for the EP3CLS150F484I7N. Our team can assist with lead times and volume pricing to support your project timeline.