EP3C5F256C7

The EP3C5F256C7 is a Cyclone® III family FPGA from Intel designed for cost- and power-sensitive applications. This device integrates 5,136 logic elements and approximately 0.42 Mbits of embedded memory with a rich I/O complement to address mid-range programmable logic needs.

Built on the Cyclone III architecture, the part targets high-volume, low-power applications where integration, flexible I/O and on-chip clock management are important. It ships in a compact 256-LBGA package suitable for surface-mount assembly and is specified for commercial temperature and RoHS-compliant manufacturing.

Key Features

• Logic Capacity — 5,136 logic elements provides a mid-range programmable fabric for glue logic, protocol bridging and custom control functions.
• Embedded Memory — Approximately 0.42 Mbits of on-chip RAM for buffering, small FIFOs and local data storage.
• I/O Density and Standards — 182 user I/Os with support in the Cyclone III family for a wide range of I/O standards to accommodate diverse interface requirements.
• Clock Management — Family-level support for integrated phase-locked loops (PLLs) enables robust clock synthesis and flexible clocking schemes for system and interface timing.
• Low-Power Family Characteristics — Cyclone III devices are described in the device handbook as optimized for low power through manufacturing process and silicon/software features, helping extend battery life and reduce cooling needs in thermally constrained designs.
• Package & Mounting — 256-LBGA surface-mount package; supplier device package listed as 256-FBGA (17 × 17) for compact PCB integration.
• Supply & Temperature — Core voltage range of 1.15 V to 1.25 V and commercial operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant for lead-free assembly and regulatory alignment in commercial products.

Typical Applications

• Portable and battery-powered devices — Low-power Cyclone III characteristics help extend battery life in handheld and portable designs.
• Consumer and industrial control — Mid-range logic capacity and plentiful I/Os support motor control, sensor aggregation and user-interface logic.
• Embedded system glue logic — Use as protocol bridges, interface adaptation and custom peripherals where moderate logic and embedded RAM are required.
• Clocked data interfaces — On-chip PLLs and flexible I/O support make the device suitable for applications requiring derived clocks and stable timing domains.

Unique Advantages

• Balanced integration: Combines logic, embedded memory and high I/O count to reduce external components and simplify board design.
• Compact package: 256-LBGA/256-FBGA (17 × 17) packaging minimizes PCB area for space-constrained designs.
• Commercial-ready specification: Specified operating temperature of 0 °C to 85 °C and RoHS compliance support mainstream production and assembly flows.
• Deterministic power envelope: Core supply defined between 1.15 V and 1.25 V enables predictable power budgeting in system design.
• Flexible clocking: Family-level PLL support enables robust clock synthesis and distribution without extensive external components.

Why Choose EP3C5F256C7?

The EP3C5F256C7 positions itself as a practical, mid-density Cyclone III FPGA option for designs that require an efficient mix of logic resources, embedded memory and I/O capability in a compact surface-mount package. Its commercial temperature rating, RoHS compliance and defined core voltage range make it suitable for mainstream embedded and consumer-facing applications.

Choose this device when you need a scalable, low-power programmable fabric with on-chip memory and flexible clock management to streamline your BOM and accelerate time-to-market while relying on the Cyclone III device family feature set described in the device handbook.

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