EP3C5E144I7N

IC FPGA 94 I/O 144EQFP
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 94 423936 5136 144-LQFP Exposed Pad

Quantity 1,269 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFP Exposed PadNumber of I/O94Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs321Number of Logic Elements/Cells5136
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits423936

Overview of EP3C5E144I7N – Cyclone® III Field Programmable Gate Array, 5136 Logic Elements, 144‑LQFP Exposed Pad

The EP3C5E144I7N is a Cyclone® III family FPGA in a 144‑LQFP exposed pad package offering 5,136 logic elements and 94 user I/Os. Designed for low-power, cost-sensitive designs, this device targets high-volume embedded systems and industrial applications that require mid-range logic density combined with on‑chip memory and flexible I/O.

Built on the Cyclone III device architecture, the device provides a balance of integration, power efficiency, and system-level features suitable for control, interface, and signal-processing tasks in thermally-challenged environments.

Key Features

  • Logic Capacity  Provides 5,136 logic elements for mid-range programmable logic implementation and glue‑logic integration.
  • Embedded Memory  Approximately 0.424 Mbits of on‑chip RAM to support buffering, FIFOs, and small data tables without external memory.
  • I/O Resources  94 user I/Os in a 144‑LQFP exposed pad package for flexible external interface options and board routing.
  • Low‑Voltage Supply  Core voltage operation between 1.15 V and 1.25 V for compatibility with low‑power system designs.
  • Package & Mounting  144‑LQFP exposed pad (20×20) surface‑mount package delivering a compact footprint with thermal pad for improved heat dissipation.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
  • Low‑Power Family Characteristics  Cyclone III family architecture emphasizes low power consumption through process and silicon optimizations, making it suitable for power‑sensitive applications.
  • Clock Management  Cyclone III devices include multiple PLLs per device for flexible clock synthesis and distribution (family feature).
  • I/O Standard Support (Family)  Cyclone III family supports a broad set of I/O standards to match diverse interface requirements, including LVTTL, LVCMOS, SSTL, HSTL, PCI/PCI‑X, LVPECL, LVDS and related standards.
  • RoHS Compliant  Manufactured to meet RoHS requirements.

Typical Applications

  • Industrial Control  Use the EP3C5E144I7N in embedded controllers, motor drives, and PLC front‑end logic where industrial temperature range and reliable I/O are required.
  • Interface Bridging and Glue Logic  Implement protocol translation, bus interfacing, and custom peripheral interfaces using the device’s abundant I/Os and on‑chip memory.
  • Low‑Power Embedded Systems  Deploy the device in battery‑aware or thermally constrained systems that benefit from the Cyclone III family’s low‑power optimizations.
  • Signal Conditioning and Timing  Leverage the device’s on‑chip memory and clock management resources for buffering, data alignment, and jitter‑sensitive interfaces.

Unique Advantages

  • Industrial‑rated operation: Supports −40 °C to 100 °C operation, enabling deployment in industrial environments without additional thermal derating.
  • Balanced mid‑range density: 5,136 logic elements and ~0.424 Mbits of embedded memory provide a compact platform for control and interface designs while avoiding external logic proliferation.
  • Wide I/O count in a compact package: 94 I/Os in a 144‑LQFP exposed pad package simplify board-level routing and reduce BOM by consolidating interfaces on a single IC.
  • Low core voltage support: 1.15–1.25 V operation aligns with low‑power system rails and helps minimize overall system power consumption.
  • Family‑level low‑power architecture: Cyclone III device family optimizations for low static power help extend battery life and reduce cooling requirements in deployed systems.
  • RoHS compliance: Meets environmental requirements for lead‑free assembly and regulatory compliance.

Why Choose EP3C5E144I7N?

The EP3C5E144I7N offers a practical balance of logic capacity, embedded memory, and I/O in a thermally capable industrial package. It is well suited for engineers building mid‑density, low‑power systems that require reliable operation across a wide temperature range and a compact, surface‑mount footprint.

With Cyclone III family characteristics such as low‑power operation and flexible clock and I/O support, the EP3C5E144I7N provides a sustainable platform for high‑volume, cost‑sensitive designs where integration and power efficiency matter.

Request a quote or submit a sales inquiry to discuss availability, lead times, and volume pricing for the EP3C5E144I7N. Our team can help specify the device for your application requirements.

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