EP3C5E144I7N
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 94 423936 5136 144-LQFP Exposed Pad |
|---|---|
| Quantity | 1,269 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 94 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 321 | Number of Logic Elements/Cells | 5136 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 423936 |
Overview of EP3C5E144I7N – Cyclone® III Field Programmable Gate Array, 5136 Logic Elements, 144‑LQFP Exposed Pad
The EP3C5E144I7N is a Cyclone® III family FPGA in a 144‑LQFP exposed pad package offering 5,136 logic elements and 94 user I/Os. Designed for low-power, cost-sensitive designs, this device targets high-volume embedded systems and industrial applications that require mid-range logic density combined with on‑chip memory and flexible I/O.
Built on the Cyclone III device architecture, the device provides a balance of integration, power efficiency, and system-level features suitable for control, interface, and signal-processing tasks in thermally-challenged environments.
Key Features
- Logic Capacity Provides 5,136 logic elements for mid-range programmable logic implementation and glue‑logic integration.
- Embedded Memory Approximately 0.424 Mbits of on‑chip RAM to support buffering, FIFOs, and small data tables without external memory.
- I/O Resources 94 user I/Os in a 144‑LQFP exposed pad package for flexible external interface options and board routing.
- Low‑Voltage Supply Core voltage operation between 1.15 V and 1.25 V for compatibility with low‑power system designs.
- Package & Mounting 144‑LQFP exposed pad (20×20) surface‑mount package delivering a compact footprint with thermal pad for improved heat dissipation.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
- Low‑Power Family Characteristics Cyclone III family architecture emphasizes low power consumption through process and silicon optimizations, making it suitable for power‑sensitive applications.
- Clock Management Cyclone III devices include multiple PLLs per device for flexible clock synthesis and distribution (family feature).
- I/O Standard Support (Family) Cyclone III family supports a broad set of I/O standards to match diverse interface requirements, including LVTTL, LVCMOS, SSTL, HSTL, PCI/PCI‑X, LVPECL, LVDS and related standards.
- RoHS Compliant Manufactured to meet RoHS requirements.
Typical Applications
- Industrial Control Use the EP3C5E144I7N in embedded controllers, motor drives, and PLC front‑end logic where industrial temperature range and reliable I/O are required.
- Interface Bridging and Glue Logic Implement protocol translation, bus interfacing, and custom peripheral interfaces using the device’s abundant I/Os and on‑chip memory.
- Low‑Power Embedded Systems Deploy the device in battery‑aware or thermally constrained systems that benefit from the Cyclone III family’s low‑power optimizations.
- Signal Conditioning and Timing Leverage the device’s on‑chip memory and clock management resources for buffering, data alignment, and jitter‑sensitive interfaces.
Unique Advantages
- Industrial‑rated operation: Supports −40 °C to 100 °C operation, enabling deployment in industrial environments without additional thermal derating.
- Balanced mid‑range density: 5,136 logic elements and ~0.424 Mbits of embedded memory provide a compact platform for control and interface designs while avoiding external logic proliferation.
- Wide I/O count in a compact package: 94 I/Os in a 144‑LQFP exposed pad package simplify board-level routing and reduce BOM by consolidating interfaces on a single IC.
- Low core voltage support: 1.15–1.25 V operation aligns with low‑power system rails and helps minimize overall system power consumption.
- Family‑level low‑power architecture: Cyclone III device family optimizations for low static power help extend battery life and reduce cooling requirements in deployed systems.
- RoHS compliance: Meets environmental requirements for lead‑free assembly and regulatory compliance.
Why Choose EP3C5E144I7N?
The EP3C5E144I7N offers a practical balance of logic capacity, embedded memory, and I/O in a thermally capable industrial package. It is well suited for engineers building mid‑density, low‑power systems that require reliable operation across a wide temperature range and a compact, surface‑mount footprint.
With Cyclone III family characteristics such as low‑power operation and flexible clock and I/O support, the EP3C5E144I7N provides a sustainable platform for high‑volume, cost‑sensitive designs where integration and power efficiency matter.
Request a quote or submit a sales inquiry to discuss availability, lead times, and volume pricing for the EP3C5E144I7N. Our team can help specify the device for your application requirements.

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Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018