EP3C5F256C6

The EP3C5F256C6 is an Intel Cyclone III field-programmable gate array (FPGA) in a 256-LBGA package. It provides a mid-range logic capacity with 5,136 logic elements and approximately 0.42 Mbits of embedded memory, optimized for cost-sensitive, low-power commercial designs.

Built on the Cyclone III device family architecture, this device targets applications that require a balance of integration, low static power consumption, and flexible I/O. Typical use cases include portable and handheld products, system control and interface logic, and low-to-mid density programmable acceleration.

Key Features

• Logic Capacity — 5,136 logic elements suitable for mid-range programmable logic tasks and glue-logic integration.
• Embedded Memory — 423,936 bits of on-chip RAM, approximately 0.42 Mbits, for buffering, state storage, and small lookup tables.
• I/O Count & Package — 182 user I/Os in a 256-LBGA package (supplier package listed as 256-FBGA, 17×17), supporting compact board layouts.
• Power Supply — Core voltage range 1.15 V to 1.25 V aligned with Cyclone III low-power operation.
• Operating Temperature — Commercial grade, 0 °C to 85 °C.
• Low-Power Family Characteristics — Based on low-power process technology and silicon optimizations aimed at minimizing static power consumption.
• Clock Management — Family-level support for multiple phase-locked loops (PLLs) for robust clock synthesis and management.
• Flexible I/O Standards — Family support for a wide range of I/O standards and features such as adjustable slew rates and on-chip termination calibration to address signal-integrity needs.
• System Reliability — Family-level features include cyclic redundancy code checker circuitry and mechanisms for configuration monitoring and remote upgrade flows.

Typical Applications

• Portable and Handheld Devices — Low static power characteristics help extend battery life for compact, battery-powered systems.
• Consumer Electronics — Programmable logic and embedded RAM allow consolidation of glue logic, protocol bridging, and control functions in space-constrained designs.
• Embedded Control and Interfaces — 182 I/Os and flexible I/O standard support make the device suitable for sensor interfacing, motor control front-ends, and display/touch controllers.
• Low-to-Mid Density Acceleration — On-chip memory and logic elements can be applied to hardware acceleration of specific data-paths or preprocessing tasks in compact systems.

Unique Advantages

• Balanced Integration: Combines 5,136 logic elements with approximately 0.42 Mbits of embedded memory to reduce external components and simplify board design.
• Commercial Temperature Rating: Operates across a 0 °C to 85 °C range, matching standard commercial product environments.
• Compact Package: 256-LBGA (256-FBGA, 17×17) enables high I/O density in a small PCB footprint for space-constrained applications.
• Power-Efficient Architecture: Built on Cyclone III low-power process technology to help meet strict power budgets in portable and thermally constrained designs.
• Flexible Clocking: Family-level PLL resources support multiple clock domains and dynamic clock management without full device reconfiguration.
• Extensive I/O Flexibility: Support for many I/O standards and on-chip termination features simplifies interfacing to a broad range of peripherals and buses.

Why Choose EP3C5F256C6?

The EP3C5F256C6 positions itself as a cost-sensitive, low-power mid-range FPGA option within the Cyclone III family. Its combination of 5,136 logic elements, approximately 0.42 Mbits of on-chip RAM, and 182 user I/Os in a 256-LBGA package delivers practical integration for commercial applications that need programmable flexibility without excessive power or board area impact.

This device is appropriate for designers seeking a proven Cyclone III family architecture—offering low static power, flexible I/O support, clock management, and family-level reliability features—while keeping BOM complexity and footprint under control.

Request a quote or submit a product inquiry to get pricing and availability for EP3C5F256C6 and support for your design requirements.