EP3C5E144I7

IC FPGA 94 I/O 144EQFP
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 94 423936 5136 144-LQFP Exposed Pad

Quantity 1,614 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFP Exposed PadNumber of I/O94Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs321Number of Logic Elements/Cells5136
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits423936

Overview of EP3C5E144I7 – Cyclone® III FPGA, 5136 Logic Elements, 144-LQFP Exposed Pad

The EP3C5E144I7 is a Cyclone® III family Field Programmable Gate Array (FPGA) in a 144-LQFP exposed-pad package designed for industrial applications. It combines a mid-range logic capacity with embedded memory, flexible I/O and low-power family-level architecture to address cost- and power-sensitive control, signal processing and embedded system designs.

As part of the Cyclone III device family, the device leverages low-power process technology and FPGA architecture features such as on-chip memory, integrated PLLs and broad I/O support to simplify system integration in industrial environments.

Key Features

  • Logic Capacity — 5,136 logic elements to implement combinational and sequential logic for mid-range applications.
  • Embedded Memory — Approximately 0.4 Mbits (423,936 bits) of on-chip RAM for buffering, FIFOs and small data storage needs.
  • I/O Count & Standards — 94 user I/Os with family-level support for a wide range of I/O standards and adjustable slew rates to improve signal integrity.
  • Clock Management — Four phase-locked loops (PLLs) per device for robust clock synthesis and distribution, with dynamic reconfiguration capability at the family level.
  • Low-Power Family Architecture — Based on Cyclone III low-power process and silicon optimizations to help meet power budgets in portable or thermally constrained systems.
  • Package & Mounting — 144-LQFP exposed pad (supplier package: 144-EQFP, 20×20) in a surface-mount form factor for PCB assembly and thermal dissipation.
  • Core Supply — Operates from a 1.15 V to 1.25 V core voltage range.
  • Industrial Temperature Grade — Rated for operation from -40 °C to 100 °C.
  • Compliance — RoHS compliant.
  • Reliability Features — Family-level features include CRC/SEU detection circuitry and system-level upgrade paths to support long-term fielded designs.

Typical Applications

  • Industrial Control — Implement motor control logic, timing, and custom state machines using mid-range logic capacity and industrial temperature range.
  • Embedded Systems — Integrate control, peripheral glue logic and simple embedded processing functions using on-chip memory and the Cyclone III family’s embedded processor support.
  • Communications & Interfaces — Support protocol bridging, interface adaptation and signal conditioning with plentiful I/Os and family-level support for diverse I/O standards.
  • Sensor Processing & Data Aggregation — Buffer and preprocess sensor data locally using embedded RAM and programmable logic to reduce upstream processing load.

Unique Advantages

  • Balanced mid-range integration: 5,136 logic elements and approximately 0.4 Mbits of embedded memory provide a compact platform for control and interface tasks without excessive BOM complexity.
  • Professional thermal and assembly footprint: 144-LQFP exposed-pad surface-mount package supports PCB-level thermal management while fitting standard assembly flows.
  • Industrial readiness: Rated for -40 °C to 100 °C operation and RoHS compliant for deployment in industrial environments.
  • Flexible clocking: Four PLLs with dynamic reconfiguration capability enable robust clock-domain management for mixed-speed interfaces.
  • Low-voltage core: 1.15 V–1.25 V supply supports designs that target modern low-power system rails.
  • Family-level ecosystem: Cyclone III family features such as low-power silicon optimizations, SEU detection circuitry and embedded processor support simplify system-level design and upgrades.

Why Choose EP3C5E144I7?

The EP3C5E144I7 positions itself as a practical mid-range FPGA option for industrial and embedded designs that require a balance of programmable logic, embedded memory and flexible I/O in a compact, thermally conscious package. Its Cyclone III family heritage brings low-power architecture, integrated clock management and system reliability features that support fielded products and iterative development.

This device suits engineers and procurement teams looking for a surface-mount FPGA with industrial temperature capability, around 5K logic elements and sufficient on-chip RAM for buffering and control functions, while benefiting from the broader Cyclone III family feature set.

Request a quote or submit a purchase inquiry to get pricing, availability and lead-time information for the EP3C5E144I7.

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