EP3C5E144C7

The EP3C5E144C7 is a Cyclone III family FPGA in a 144‑lead LQFP exposed‑pad package designed for low‑power, cost‑sensitive applications. This device integrates 5,136 logic elements, approximately 0.424 Mbits of embedded memory, and 94 user I/Os to support mid‑range logic and I/O‑constrained system designs.

Built on Cyclone III family technology, the device benefits from low‑power process optimizations and family features such as configurable PLLs and support for a wide range of I/O standards. The part operates from a core supply of 1.15 V to 1.25 V and is rated for commercial temperature operation (0 °C to 85 °C). RoHS compliance is provided.

Key Features

• Logic Capacity — 5,136 logic elements suitable for mid‑range FPGA designs requiring moderate logic density.
• Embedded Memory — Approximately 0.424 Mbits of on‑chip RAM to support buffering, small LUT RAMs, and embedded storage needs.
• I/O Count & Flexibility — 94 user I/Os to accommodate diverse peripheral and bus interfaces in compact systems.
• Low‑Voltage Core — Core supply voltage range of 1.15 V to 1.25 V for compatibility with Cyclone III power domains.
• Package — 144‑lead LQFP with exposed pad (supplier package 144‑EQFP, 20×20) for PCB thermal and grounding options in surface‑mount assemblies.
• Commercial Grade — Rated for operation from 0 °C to 85 °C, suited to commercial and many embedded applications.
• Family Features — Cyclone III family characteristics including low‑power TSMC process optimizations, multiple PLLs for clock management, and available embedded processor IP support for system integration.
• Regulatory — RoHS‑compliant manufacturing.

Typical Applications

• Consumer Electronics — Implement user interfaces, peripheral bridging, and protocol adaptation in compact, low‑power devices.
• Portable and Battery‑Powered Systems — Leverage Cyclone III low‑power characteristics for extended battery life in handheld equipment.
• Communications & Networking — Mid‑range datapath control, interface aggregation, and clock management using available PLL resources.
• Industrial Control (Commercial‑Grade) — Sensor interfacing, control logic, and protocol conversion within commercial temperature environments.

Unique Advantages

• Low‑power family foundation: Cyclone III process and design optimizations reduce static power consumption, supporting thermally efficient designs.
• Balanced integration: Combines moderate logic density (5,136 logic elements) with on‑chip memory and 94 I/Os to reduce external components and simplify board design.
• Compact, serviceable package: 144‑lead LQFP exposed pad (20×20) offers a small footprint with PCB thermal and ground plane options for thermally aware layouts.
• Flexible clock management: Family‑level PLL features enable robust clocking and interface timing control without disclosing specific device counts.
• Commercial temperature rating: 0 °C to 85 °C operation aligns with a wide range of commercial embedded applications.
• Standards‑aware I/O: High I/O count supports diverse external interfaces, easing integration with sensors, memory, and peripherals.

Why Choose EP3C5E144C7?

The EP3C5E144C7 offers a balanced mix of logic capacity, embedded memory, and I/O density in a compact, surface‑mount exposed‑pad package tailored for cost‑sensitive and low‑power designs. Its Cyclone III family heritage brings power‑aware silicon and system‑level features that simplify clocking and integration while helping manage power budgets.

This part is well suited for engineers building mid‑range FPGA solutions in consumer, portable, communications, and commercial embedded systems who need a compact, RoHS‑compliant device with a defined commercial temperature range and straightforward power requirements.

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