EP3C5E144C8

IC FPGA 94 I/O 144EQFP
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 94 423936 5136 144-LQFP Exposed Pad

Quantity 1,480 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFP Exposed PadNumber of I/O94Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs321Number of Logic Elements/Cells5136
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits423936

Overview of EP3C5E144C8 – Cyclone® III FPGA, 5,136 logic elements, ~0.42 Mbits RAM, 94 I/Os, 144-LQFP

The EP3C5E144C8 is a Cyclone III family field programmable gate array (FPGA) in a 144-LQFP exposed pad package, offering 5,136 logic elements and approximately 0.42 Mbits of embedded memory. Designed for commercial-grade, low-power, cost-sensitive applications, this device targets designs that require moderate logic density, flexible I/O, and on-chip clock management.

Built on the Cyclone III device architecture, the device provides a combination of low power operation and integration suited for portable and thermally constrained systems, as well as general-purpose embedded and I/O‑centric applications.

Key Features

  • Logic Capacity — 5,136 logic elements (LEs) to implement moderate-complexity digital logic and control functions.
  • Embedded Memory — Approximately 0.42 Mbits (423,936 bits) of on-chip RAM for buffers, FIFOs, and small data storage.
  • I/O Density — 94 user I/Os to support multiple peripheral interfaces and parallel connections on a single device.
  • Clock Management — Family-level support for up to four phase-locked loops (PLLs) with multiple outputs and dynamic reconfiguration for flexible clocking and frequency synthesis.
  • I/O Standards & Signal Integrity — Cyclone III family features include adjustable I/O slew rates and support for a broad set of I/O standards and on‑chip termination calibration to improve signal integrity across PVT conditions.
  • Power — Low-power device family characteristics enabled by low-power process technology and power-aware design flows; device core supply 1.15 V to 1.25 V.
  • Package & Mounting — Surface-mount 144-LQFP exposed pad (supplier package 144-EQFP, 20×20) for PCB integration and thermal conduction through the exposed pad.
  • Commercial Temperature Grade — Operating temperature range 0 °C to 85 °C for commercial applications.
  • Regulatory — RoHS compliant.

Typical Applications

  • Portable and Handheld Devices — Low-power characteristics and on-chip resources help extend battery life and reduce cooling requirements in portable systems.
  • Embedded Control and Interface Hubs — Moderate logic density and 94 I/Os are suitable for control logic, sensor aggregation, and multi-protocol interface bridging.
  • Low-Power, High-Volume Electronics — Targeted at cost-sensitive, high-volume designs where a balance of functionality and power efficiency is required.
  • Clocked Systems and Signal Processing Front-Ends — Multiple PLLs and embedded memory support robust clock management and local data buffering for timing-critical designs.

Unique Advantages

  • Balanced Logic and Memory — 5,136 logic elements paired with approximately 0.42 Mbits of embedded RAM provide a compact, self-contained resource set for mid-range designs.
  • Flexible I/O and Signal Integrity — High I/O count and adjustable slew rates with multi-value on-chip termination calibration simplifies interfacing to diverse external devices while maintaining signal quality.
  • Configurable Clocking — Up to four PLLs with multiple outputs and dynamic reconfiguration enable precise and flexible clock trees without full device reprogramming.
  • Low-Power Family Characteristics — Built on low-power process technology and power-aware design practices to help meet constrained power budgets common in handheld and thermally-challenged environments.
  • Compact, PCB-Friendly Package — 144-LQFP exposed pad package provides a standard surface-mount solution with enhanced thermal path through the exposed pad.
  • Commercial-Grade Availability — Designed for commercial applications with a 0 °C to 85 °C operating range and RoHS compliance for broad manufacturability.

Why Choose EP3C5E144C8?

EP3C5E144C8 positions itself as a practical Cyclone III family FPGA option for designers who need a low-power, cost-effective device with moderate logic capacity, significant I/O, and embedded memory. Its combination of configurable clocking, on‑chip RAM, and flexible I/O make it well suited to embedded controllers, interface bridges, and portable product designs.

Backed by Cyclone III family design resources and tool flows, this device offers a clear path for integrating mid-range programmable logic into volume-oriented, power-conscious products while keeping board-level complexity and BOM impact under control.

Request a quote or submit an inquiry to receive pricing and availability for the EP3C5E144C8. Our team can provide lead-time estimates and support for qualification and procurement.

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