EP3C5E144C8
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 94 423936 5136 144-LQFP Exposed Pad |
|---|---|
| Quantity | 1,480 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 94 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 321 | Number of Logic Elements/Cells | 5136 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 423936 |
Overview of EP3C5E144C8 – Cyclone® III FPGA, 5,136 logic elements, ~0.42 Mbits RAM, 94 I/Os, 144-LQFP
The EP3C5E144C8 is a Cyclone III family field programmable gate array (FPGA) in a 144-LQFP exposed pad package, offering 5,136 logic elements and approximately 0.42 Mbits of embedded memory. Designed for commercial-grade, low-power, cost-sensitive applications, this device targets designs that require moderate logic density, flexible I/O, and on-chip clock management.
Built on the Cyclone III device architecture, the device provides a combination of low power operation and integration suited for portable and thermally constrained systems, as well as general-purpose embedded and I/O‑centric applications.
Key Features
- Logic Capacity — 5,136 logic elements (LEs) to implement moderate-complexity digital logic and control functions.
- Embedded Memory — Approximately 0.42 Mbits (423,936 bits) of on-chip RAM for buffers, FIFOs, and small data storage.
- I/O Density — 94 user I/Os to support multiple peripheral interfaces and parallel connections on a single device.
- Clock Management — Family-level support for up to four phase-locked loops (PLLs) with multiple outputs and dynamic reconfiguration for flexible clocking and frequency synthesis.
- I/O Standards & Signal Integrity — Cyclone III family features include adjustable I/O slew rates and support for a broad set of I/O standards and on‑chip termination calibration to improve signal integrity across PVT conditions.
- Power — Low-power device family characteristics enabled by low-power process technology and power-aware design flows; device core supply 1.15 V to 1.25 V.
- Package & Mounting — Surface-mount 144-LQFP exposed pad (supplier package 144-EQFP, 20×20) for PCB integration and thermal conduction through the exposed pad.
- Commercial Temperature Grade — Operating temperature range 0 °C to 85 °C for commercial applications.
- Regulatory — RoHS compliant.
Typical Applications
- Portable and Handheld Devices — Low-power characteristics and on-chip resources help extend battery life and reduce cooling requirements in portable systems.
- Embedded Control and Interface Hubs — Moderate logic density and 94 I/Os are suitable for control logic, sensor aggregation, and multi-protocol interface bridging.
- Low-Power, High-Volume Electronics — Targeted at cost-sensitive, high-volume designs where a balance of functionality and power efficiency is required.
- Clocked Systems and Signal Processing Front-Ends — Multiple PLLs and embedded memory support robust clock management and local data buffering for timing-critical designs.
Unique Advantages
- Balanced Logic and Memory — 5,136 logic elements paired with approximately 0.42 Mbits of embedded RAM provide a compact, self-contained resource set for mid-range designs.
- Flexible I/O and Signal Integrity — High I/O count and adjustable slew rates with multi-value on-chip termination calibration simplifies interfacing to diverse external devices while maintaining signal quality.
- Configurable Clocking — Up to four PLLs with multiple outputs and dynamic reconfiguration enable precise and flexible clock trees without full device reprogramming.
- Low-Power Family Characteristics — Built on low-power process technology and power-aware design practices to help meet constrained power budgets common in handheld and thermally-challenged environments.
- Compact, PCB-Friendly Package — 144-LQFP exposed pad package provides a standard surface-mount solution with enhanced thermal path through the exposed pad.
- Commercial-Grade Availability — Designed for commercial applications with a 0 °C to 85 °C operating range and RoHS compliance for broad manufacturability.
Why Choose EP3C5E144C8?
EP3C5E144C8 positions itself as a practical Cyclone III family FPGA option for designers who need a low-power, cost-effective device with moderate logic capacity, significant I/O, and embedded memory. Its combination of configurable clocking, on‑chip RAM, and flexible I/O make it well suited to embedded controllers, interface bridges, and portable product designs.
Backed by Cyclone III family design resources and tool flows, this device offers a clear path for integrating mid-range programmable logic into volume-oriented, power-conscious products while keeping board-level complexity and BOM impact under control.
Request a quote or submit an inquiry to receive pricing and availability for the EP3C5E144C8. Our team can provide lead-time estimates and support for qualification and procurement.

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