EP3C55U484I7N

The EP3C55U484I7N is a Cyclone® III family field programmable gate array (FPGA) offering a balance of high integration and low power for cost-sensitive designs. Based on the Cyclone III architecture and TSMC low-power process technology, this device targets high-volume, low-power applications that require substantial logic density, on‑chip memory, and flexible I/O.

With 55,856 logic elements, approximately 2.40 Mbits of embedded memory, and up to 327 I/Os in a 484‑FBGA package, the EP3C55U484I7N is suited to embedded systems, communications interfaces, and other applications where integration and power efficiency matter.

Key Features

• Logic Capacity — 55,856 logic elements provide substantial programmable logic resources for complex glue logic, protocol handling, and custom datapaths.
• Embedded Memory — Approximately 2.40 Mbits of on‑chip RAM for buffering, FIFOs, and local storage without external memory dependence.
• I/O Flexibility — 327 user I/O pins support a wide range of external interfaces and peripheral connections for I/O‑constrained designs.
• Clock Management — Cyclone III family clocking architecture includes multiple PLLs for robust clock synthesis and distribution (family feature).
• Low‑Voltage Core — Core supply range from 1.15 V to 1.25 V to support low-power system designs.
• Package and Mounting — 484‑FBGA device in a 484‑UBGA (19×19) footprint, designed for surface-mount assembly.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for use in industrial environments.
• RoHS Compliant — Device meets RoHS environmental requirements.

Typical Applications

• Embedded Control and Processing — Implement custom control logic, peripheral interfaces, and light‑weight embedded processing while leveraging on‑chip memory and logic density.
• Industrial Automation — Deploy in motor control, sensor aggregation, and machine I/O systems that require industrial temperature operation and high I/O counts.
• Portable and Low‑Power Devices — Use in battery‑sensitive or thermally constrained products that benefit from the Cyclone III low‑power architecture and reduced core voltage.
• High‑Volume, Cost‑Sensitive Systems — Integrate into designs where minimizing BOM and achieving competitive unit cost are priorities while keeping substantial programmable capability.

Unique Advantages

• High Logic Density: 55,856 logic elements support complex designs without external FPGA hopping or excessive part counts.
• Significant On‑Chip Memory: Approximately 2.40 Mbits of embedded RAM reduces dependence on external memory, lowering BOM and board complexity.
• Broad I/O Count: 327 I/Os enable direct interfacing to multiple peripherals and buses, simplifying board-level routing and design.
• Low‑Voltage Operation: 1.15–1.25 V core supply supports power‑optimized system architectures and helps meet tight power budgets.
• Industrial Temperature Rating: Operation from −40 °C to 100 °C suits demanding environmental requirements common in industrial deployments.
• Surface‑Mount, Compact Package: 484‑FBGA (484‑UBGA, 19×19) provides a compact, manufacturable footprint for high‑density PCB designs.

Why Choose EP3C55U484I7N?

The EP3C55U484I7N positions itself as a practical choice for designers who need substantial programmable logic and on‑chip memory in a low‑power, industrial‑rated FPGA. Its balance of logic capacity, embedded RAM, and a high I/O count makes it suitable for embedded control, I/O‑rich systems, and cost‑sensitive product lines where integration and power efficiency are essential.

Backed by the Cyclone III family architecture and its low‑power silicon profile, this device delivers a reliable platform for scaling designs over production volumes while simplifying board-level integration and lowering system power.

Request a quote or contact sales to check pricing and availability for the EP3C55U484I7N.