EP3C55U484C8N

The EP3C55U484C8N is a Cyclone III family FPGA from Intel designed for low-power, cost-sensitive, high-volume applications. It leverages the Cyclone III device architecture to deliver a balance of logic density, embedded memory, and I/O capacity suitable for system integration and control tasks.

This device is targeted at designs that require approximately 55,856 logic elements, roughly 2.4 Mbits of on-chip RAM, and a high I/O count while operating within a commercial temperature range and a 1.15 V–1.25 V core supply window.

Key Features

• Logic Capacity  55,856 logic elements provide ample programmable fabric for mid-range designs and complex glue-logic implementations.
• Embedded Memory  Approximately 2.4 Mbits of on-chip RAM supports buffering, packet queues, and local data storage without external memory in many use cases.
• I/O Resources  327 user I/O pins support high peripheral connectivity and flexible interfacing to external devices and subsystems.
• Low-Power Family Characteristics  As a Cyclone III device, it benefits from TSMC low-power process optimizations and family-level design features aimed at minimizing power consumption for battery-powered and thermally constrained designs.
• Clocking and Integration  Cyclone III family architecture includes multi-PLL support and system integration features (documented in the device handbook) to simplify clock management and system-level integration.
• Package and Mounting  484-FBGA (484-UBGA, 19×19) package in a surface-mount form factor for compact PCB layouts.
• Supply and Temperature  Core voltage range 1.15 V to 1.25 V and commercial operating range 0 °C to 85 °C, suitable for consumer and portable electronics.
• Compliance  RoHS compliant for environmental and manufacturing process compatibility.

Typical Applications

• Portable and Handheld Devices  Low-power Cyclone III characteristics and compact FBGA packaging support battery-powered product designs and portable instrumentation.
• High-Volume Consumer Electronics  Mid-range logic density, integrated memory, and abundant I/O make the device suitable for consumer systems that prioritize cost and integration.
• Thermally-Challenged Systems  Low static power characteristics enable operation in environments where cooling is constrained or reduced thermal budgets are required.
• I/O-Intensive Interfaces  High user I/O count supports bridging, protocol conversion, and multi-channel interface tasks without extensive external glue logic.

Unique Advantages

• High Logic Density: 55,856 logic elements let you implement substantial programmable logic and state machines within a single device, reducing BOM complexity.
• Generous Local Memory: Approximately 2.4 Mbits of embedded RAM enables on-chip buffering and reduces dependency on external memory components.
• Large I/O Budget: 327 I/O pins support multiple peripherals and parallel interfaces, simplifying board routing and system partitioning.
• Low-Power Silicon: Built on the Cyclone III low-power platform, the device supports designs with tight power and thermal constraints.
• Compact Surface-Mount Package: 484-FBGA (19×19) offers a space-efficient footprint for dense PCB designs.
• Regulatory Readiness: RoHS compliance supports modern manufacturing and regulatory requirements.

Why Choose EP3C55U484C8N?

The EP3C55U484C8N delivers a balanced combination of mid-range logic capacity, on-chip memory, and substantial I/O in a low-power Cyclone III platform. Its electrical and thermal characteristics make it suitable for portable, consumer, and other cost-sensitive applications where power efficiency and integration matter.

Supported by the Cyclone III device family architecture and associated development resources, this FPGA is a practical choice for designers seeking scalable logic, integrated memory, and robust I/O without compromising on power or package density.

Request a quote or submit an RFQ to get pricing and availability information for the EP3C55U484C8N. Our team will respond with the details you need to evaluate this Cyclone III FPGA for your next design.