EP3C5F256C6N

The EP3C5F256C6N is an Intel Cyclone III field programmable gate array (FPGA) packaged in a 256-LBGA surface-mount package. It provides 5,136 logic elements and approximately 0.4 Mbits of embedded memory, making it suitable for mid-range digital logic integration in cost- and power-sensitive designs.

With 182 user I/O pins, a low-voltage core supply (1.15 V to 1.25 V), commercial operating range (0 °C to 85 °C), and RoHS compliance, this device targets high-volume, low-power applications that require flexible interfacing and compact board-level integration.

Key Features

• Logic Capacity  5,136 logic elements for implementing combinational and sequential logic, custom peripherals, and glue-logic functions.
• Embedded Memory  Approximately 0.4 Mbits of on-chip RAM (423,936 bits) to support buffering, LUTs, and small data storage needs.
• I/O Density  182 user I/O pins to accommodate multiple interfaces and parallel buses on a single device.
• Low-Voltage Core  Core supply range of 1.15 V to 1.25 V for compatibility with low-power system designs.
• Clock Management (family feature)  Cyclone III family devices provide robust clocking with up to four PLLs per device and multiple outputs per PLL for common clocking and synthesis needs.
• I/O Standards (family feature)  Cyclone III family supports a wide range of I/O standards to simplify interfacing, including LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X, LVPECL, BLVDS, LVDS, mini-LVDS, RSDS, and PPDS.
• Package & Mounting  256-LBGA package (supplier package: 256-FBGA, 17×17) in a surface-mount form factor for space-efficient PCB designs.
• Operating Grade & Compliance  Commercial grade operation from 0 °C to 85 °C and RoHS compliance for regulatory alignment.

Typical Applications

• Portable and Handheld Devices  Low core-voltage operation and family-level low-power optimizations help extend battery life in portable systems.
• Consumer Electronics  Mid-range logic and on-chip memory allow integration of custom control, UI logic, and peripheral glue for cost-sensitive consumer products.
• Embedded Processing & Peripherals  Use the FPGA’s logic and memory to implement custom accelerators, protocol bridges, and peripheral controllers in compact designs.
• Communications Interfaces  High I/O count and family support for multiple I/O standards enable implementation of diverse serial and parallel interfaces.

Unique Advantages

• Balanced Mid-Range Capacity:  5,136 logic elements and embedded RAM provide a practical balance between integration and cost for mid-complexity designs.
• Flexible I/O Resources:  182 I/Os let you consolidate multiple interfaces on a single device, reducing board-level components and routing complexity.
• Low-Voltage Operation:  1.15 V–1.25 V core supply supports low-power system architectures and modern power-rail strategies.
• Package Density for Compact Boards:  256-LBGA (17×17) surface-mount package supports dense PCB layouts while retaining robust I/O connectivity.
• Family-Level Ecosystem:  Access to Cyclone III family features and design resources—such as clock management, I/O standard support, and verified IP—helps accelerate development and integration.
• Regulatory and Manufacturing Readiness:  Commercial grade temperature range and RoHS compliance simplify adoption in mainstream production environments.

Why Choose EP3C5F256C6N?

The EP3C5F256C6N combines mid-range programmable logic capacity, substantial I/O density, and embedded memory in a compact 256-LBGA surface-mount package. Its low-voltage core and Cyclone III family optimizations make it a practical choice for designers targeting high-volume, power-conscious applications that require flexible interfacing and on-chip integration.

Ideal for product teams that need a proven FPGA platform with accessible design resources, this device offers a balance of integration, manufacturability, and ecosystem support to streamline time-to-market for consumer and portable applications.

Request a quote or submit a pricing inquiry to check availability and lead times for EP3C5F256C6N.