EP3C40Q240C8

The EP3C40Q240C8 is an Intel Cyclone® III family FPGA delivered in a 240-pin BFQFP package for surface-mount applications. It provides 39,600 logic elements and approximately 1.16 Mbits of embedded memory, balanced with a 128-pin I/O count to support complex glue-logic, protocol bridging, and embedded control tasks.

Built on the Cyclone III device family architecture, this device targets high-volume, low-power, cost-sensitive applications where integration, I/O density, and efficient on-chip resources matter. It is offered as a commercial-grade, RoHS-compliant component for designs operating between 0 °C and 85 °C.

Key Features

• Logic Capacity  39,600 logic elements provide substantial programmable fabric for glue logic, protocol handling, and custom control functions.
• Embedded Memory  Approximately 1.16 Mbits of on-chip RAM to support FIFOs, buffers, and local data storage without external memory.
• I/O Resources  128 available I/O pins support a wide range of board-level interfaces and peripheral connections for flexible system integration.
• Low-Voltage Core  Core supply voltage range of 1.15 V to 1.25 V to match low-power system rails and minimize power dissipation.
• Clock Management  Cyclone III family clocking features include up to four phase-locked loops (PLLs) per device with five outputs per PLL, enabling robust clock synthesis and distribution.
• I/O Standards and Signal Integrity  Family support for a broad set of I/O standards and adjustable slew rates improves compatibility with diverse interfaces and helps maintain signal integrity.
• Package and Mounting  Supplied in a 240-BFQFP package (supplier designation 240-PQFP, 32×32) for surface-mount PCB assembly.
• Commercial Grade & Environmental  Commercial operating temperature range of 0 °C to 85 °C and RoHS-compliant manufacturing.

Typical Applications

• Embedded Control  Use as a programmable control engine for automation, display controllers, and appliance logic where moderate logic density and on-chip memory are required.
• Protocol Bridging and Interface Conversion  128 I/Os and flexible I/O standards support implementation of bus bridging, level translation, and custom interface logic.
• Signal Conditioning and Data Buffering  On-chip RAM and configurable logic enable local buffering, FIFO management, and pre-processing of streaming data.
• Low-Power Handheld and Portable Equipment  Cyclone III family low-power attributes make the device suitable for battery-aware designs and thermally constrained enclosures.

Unique Advantages

• Substantial Logic & Memory in a Single Device: 39,600 logic elements paired with approximately 1.16 Mbits of embedded RAM reduce reliance on external components.
• High I/O Density: 128 I/Os enable greater system consolidation and simplify PCB routing for multi-interface designs.
• Flexible Clocking: Multiple PLLs with numerous outputs allow designers to generate and distribute multiple clock domains on-chip.
• Low-Voltage Core Operation: 1.15 V–1.25 V supply range supports integration into modern low-power systems.
• Surface-Mount Packaging: 240-pin BFQFP (240-PQFP, 32×32) balances pin count and PCB area for compact assemblies.
• Regulatory and Assembly Readiness: RoHS compliance and commercial-grade temperature rating support standard manufacturing and deployment practices.

Why Choose EP3C40Q240C8?

The EP3C40Q240C8 places a well-balanced mix of programmable logic, embedded memory, and I/O capability into a single commercial-grade Cyclone III FPGA package. It suits designs that require moderate-to-high logic density, local memory for buffering, and a sizable I/O pool while operating on low core voltages.

This part is a practical choice for teams focused on cost-sensitive, high-volume devices where power efficiency, on-chip integration, and a broad ecosystem of Cyclone III family tools and IP can shorten development time and reduce system BOM complexity.

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