EP3C40F780I7

The EP3C40F780I7 is a Cyclone III family FPGA provided by Intel, offering a balance of integration and low-power operation for volume-sensitive and embedded designs. This device combines approximately 39,600 logic elements with roughly 1.16 Mbits of embedded memory and 535 user I/Os in a 780-ball FBGA package, targeting applications that need moderate logic density, abundant I/O, and industrial temperature support.

Key Features

• Logic Capacity — Approximately 39,600 logic elements provide the programmable fabric needed for mid-range digital logic, custom datapaths, and control functions.
• Embedded Memory — Approximately 1.16 Mbits of on-chip RAM for FIFOs, buffering, and local data storage without external memory.
• I/O and Package — 535 user I/Os in a 780-FBGA (29 × 29 mm) package, enabling dense board integration and a large number of external interfaces.
• Power Supply — Core supply range of 1.15 V to 1.25 V supports low-voltage system designs and power-optimized operation.
• Industrial Temperature Grade — Specified operating range from −40°C to 100°C for reliable operation in industrial environments.
• Mounting and Compliance — Surface-mount 780-BGA package and RoHS-compliant construction for modern PCB assembly and environmental requirements.
• Cyclone III Family Characteristics — Family-level attributes from the Cyclone III handbook include low-power process technology and device features that favor low-power, cost-sensitive applications, as well as device-level clock-management resources and a library of pre-built IP for accelerated development.

Typical Applications

• Portable and Handheld Equipment — Low-power architecture and modest logic density make the device suitable for battery-aware designs where power budget and integration are important.
• Industrial Control — Industrial temperature rating and extensive I/O count support sensor interfacing, motor control peripherals, and distributed control systems.
• Communications and I/O Aggregation — High I/O availability and embedded memory enable protocol bridging, data buffering, and custom interface glue logic.
• Embedded Processing and System Integration — On-chip RAM and logic resources allow implementation of custom accelerators, control logic, and system glue functions without heavy external components.

Unique Advantages

• Balanced Logic-to-Memory Ratio: Approximately 39,600 logic elements paired with ~1.16 Mbits of embedded RAM provide the flexibility to implement both logic-heavy and memory-assisted functions on one device.
• High I/O Density: 535 user I/Os in a 780-FBGA footprint simplify board-level routing for multi-interface designs and reduce the need for external I/O expanders.
• Industrial Reliability: Specified −40°C to 100°C operating range and industrial grade ensure operation across common industrial environments.
• Low-Voltage Core Operation: 1.15 V to 1.25 V core supply supports power-optimized designs and aligns with modern low-voltage system architectures.
• RoHS Compliant: Environmentally compliant materials and processes support contemporary manufacturing and regulatory needs.
• Family-Level Development Resources: Cyclone III family documentation and IP availability help accelerate design development and system integration.

Why Choose EP3C40F780I7?

The EP3C40F780I7 positions itself as a mid-range, industrial-grade FPGA that combines sizeable programmable logic, on-chip memory, and a large I/O complement in a compact 780-FBGA package. It is suited to designers who need a cost-conscious, low-voltage programmable device with enough resources to replace multiple discrete components and simplify board-level design.

For teams focused on scalable, repeatable production in industrial and embedded markets, this Cyclone III device delivers measurable integration, operating temperature headroom, and compliance attributes that support long-term deployment and maintainability.

Request a quote or submit your product requirements today to evaluate EP3C40F780I7 for your next design.